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Lead-free welding materials with tin, selenium and copper

A lead-free solder, tin-selenium technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of restricting the widespread use and reduction of lead-free solder, and is conducive to no-cleaning and expanding the coverage area. , the effect of reducing oxidation

Inactive Publication Date: 2006-08-16
戴国水
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Limits widespread use of lead-free solder
At present, there are some lead-free solders in which phosphorus is added to reduce surface tension and improve oxidation resistance, but phosphorus is a very easily oxidized element with a melting point of 59°C and a boiling point of 280°C, which is very close to the temperature required for soldering , so phosphorus will gasify during use, reducing its effect as a surface tension reducer and anti-oxidant improver

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Embodiment 1: the composition of each component is by weight percentage, is respectively: selenium (Se) 0.04-0.09%, copper (Cu) 0.5-0.8%, the impurity that total amount is not more than 0.05%, all the other are tin (Sn) , The weight percentage summation of each component is 100%.

Embodiment 2

[0013] Embodiment 2: the composition of each component is by weight percentage, is respectively: selenium (Se) 0.03-0.08%, copper (Cu) 2.5-2.9%, the impurity that total amount is not more than 0.05%, all the other are tin (Sn) .

Embodiment 3

[0014] Embodiment 3: the composition of each component is by weight percentage, is respectively: selenium (Se) 0.03-0.08%, copper (Cu) 4.5-5%, the impurity that total amount is not more than 0.05%, all the other are tin (Sn) .

[0015] The composition of each component in the impurity of the above-mentioned embodiment is respectively by weight percent: iron (Fe)≤0.01%, silicon (Si)≤0.01%, lead (Pb)≤0.03%, cadmium (Cd)≤0.002%.

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PUM

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Abstract

A Pb-free Sn-Se-Cu solder for soldering electronic devices contains Se (0.01-0.1 Wt%), Cu (0.3-6), impurities (0-0.05) including Fe, Si, Pb and Gd, and Sn (rest). Its advantages are low surface tension in molten state, high solderability, and less surface oxidizing.

Description

technical field [0001] The invention relates to a tin-selenium-copper lead-free solder, which belongs to the technical field of preparation of materials for welding electronic components. Background technique [0002] Leaded and lead-free soldering metal materials have been widely used. The typical traditional product is tin-lead solder, which contains more than 30% lead by weight. Lead is highly toxic to the human body, so it is being completely replaced by lead-free solder. Lead-free solders currently mainly include tin-copper-silver alloy and tin-copper alloy solder, but tin-copper-silver alloy contains about 3.5% silver by weight, which is expensive, and the surface tension of most lead-free solders is significantly higher than that of eutectic tin lead solder, thereby reducing the wetting properties of lead-free solder, and the wetting effect on the substrate surface is poor. In addition, most lead-free solders have higher melting temperatures tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 戴国水金成焕
Owner 戴国水