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Optical reading device

A reading device, optical technology, applied in the direction of optical recording head, beam source, laser, etc.

Inactive Publication Date: 2006-08-23
IDEMITSU KOSAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In Japanese Patent Laid-Open No. 10-293940, a holding container for an optical pickup device is disclosed, which is characterized in that it is formed from a resin composition with a thermal conductivity of 1 W / mK or more. The container maintains the junction between the containers without exposing anything
[0009] In addition to the above, thermal grease is generally used to dissipate heat from semiconductors such as transistors using heat sinks, but this is limited to heat sinks made of metals with high thermal conductivity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0047] Hereinafter, the present invention will be described more specifically based on examples, but the present invention is not limited by these

[0048] Any limitations of the examples.

manufacture example 1

[0050] [production of cover material]

[0051] (1) Synthesis of polyphenylene sulfide (PPS) prepolymer

[0052] To the raw material synthesis tank (1m 3 ) into N-methyl-2-pyrrolidone (NMP) 554kg and lithium hydroxide (LiOH·1H 2 (0) 100kg, the temperature of the synthesis tank was raised to 140°C, and kept at 140°C, and the water contained in the raw material lithium hydroxide was distilled off in batches. After completion of this operation, 65 Nkl of gaseous hydrogen sulfide was blown into the reaction solution while maintaining the temperature at 130°C. Through this operation, lithium hydrosulfide (LiSH) is synthesized according to the following formula (1).

[0053] ... (I)

[0054] Next, the blowing of hydrogen sulfide was stopped, and the temperature of the synthesis tank was raised to 205°C. As the temperature rises, the water generated as a by-product when hydrogen sulfide is blown in is removed in batches, and the reaction represented by the following formu...

Embodiment 1-8、 comparative example 1-7

[0075] (1) Using the PPS composite materials having different thermal conductivity synthesized in Production Example 1, an optical pickup cover was fabricated by injection molding.

[0076] Next, mount the laser diode and the brass stem, and fix the stem to the housing using the following adhesives with different thermal conductivity to manufacture figure 1 The optical pickup device shown in .

[0077] Table 1 shows combinations of covers and adhesives used in Examples and Comparative Examples.

[0078] The adhesives used in this example and their thermal conductivity are as follows.

[0079] (A) SE4450 (manufactured by Toray Douko-ning Sirikon Co., Ltd.)

[0080] 1.88W / mK

[0081] (B) SE4401 (manufactured by Toray Douko-ning Sirikon Co.)

[0082] 0.92W / mK

[0083] (C) SE9175 (manufactured by Toray Douko-ning Sirikon Co.)

[0084] 0.3W / mK

[0085] In addition, the adhesive used to bond the flange and cover of the laser (equivalent to figure 1 The adhesive 11) and its t...

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Abstract

In an optical reading device (1), a continuous structure body is formed by a laser (3), a stem (5) for laser installation, a housing (7), and an adhesive (9) for adhering the stem (5) and the housing (7). The members (3, 5, 7, 9) are formed from materials having a thermal conductivity coefficient of not less than 0.5 W / mK. Heat of the laser (3) is effectively discharged to outside the housing (7) through the continuous structure body (5, 7, 9). Temperature rise of the laser in the optical reading device is reduced, so that reliability and life of the device are improved.

Description

technical field [0001] The present invention relates to devices for reading / writing optical media such as CD-ROM, CD-R, CD-RW, CD-RAM, DVD-ROM, DVD-R, DVD-RW, DVD-RAM, Blue-Ray disc, etc. And other optical reading devices, optical pickup devices. Background technique [0002] In an optical medium reading / writing device, an adhesive is generally used when bonding a housing and a stem, but the thermal conductivity of the adhesive used has not been investigated so far. Therefore, the heat radiation route from the laser as a heat source to the housing, chassis, etc. is cut off, and heat radiation cannot be performed smoothly, resulting in adverse effects due to heat generation. In particular, a cover in which a polyarylene sulfide resin composition is often used as a thermoplastic resin, and a bonded portion of the stem and the cover have low thermal conductivity, and thus become a structure exhibiting thermal resistance. [0003] With the popularization of writing type and hi...

Claims

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Application Information

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IPC IPC(8): G11B7/12H01S5/022G11B7/125H01S5/024
CPCH01S5/0683G11B7/127H01S5/0231H01S5/02469
Inventor 木之内智后藤浩文
Owner IDEMITSU KOSAN CO LTD
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