Chip architecture with multiple functions

Abstract

This invention relates to multifunctional chip structure that its outside is coated by a packaging body. It includes a chip seat, a first chip is set on the seat, and the first chip has control function. At least one second chip set on the seat and beside the first chip, it has preset function. Several pins set around the chip, so the signal output from the first and second chip can be extracted out the packaging body; the pin number is same to the situation of the first chip packaged. Several throwing mat are set on the two chips, and at least any two mats are common online of the two chips. Several throwing are welded to the mat, pins said above, and between the chip seat to make signal connecting between the first chip, second chip, pins and the chip seat.

Description

technical field [0001] The present invention relates to a multi-functional chip architecture, in particular to a chip architecture with multiple chips and different manufacturing processes among the chips. Background technique [0002] So far, most microcontroller chips or microprocessor chips have no built-in non-volatile memory in their packages, so after the products containing these chips are powered off, these chips cannot actively retain the stored data . Products containing these chips must store the data stored in the chip through non-volatile memory, such as electrically erasable read-only memory (EEPROM), flash memory (Flashmemory), magnetic memory (MRAM), etc. stored data. In other words, some current products containing microcontroller chips or microprocessor chips must additionally use non-volatile memory outside the package to store data after the product is powered off. Under the above circumstances, not only the cost of the chip and the external memory is ...

AI Technical Summary

Problems solved by technology

Although this point can be simplified in the manufacturing process, it is not flexible in the production of products, and it is not conducive to effective cost reduction.

Moreover, when faced with different memory capacity or characteristic requirements, considering a single process, the chip itself must be additionally designed with non-volatile memory of different memory capacity or type, which is not conducive to the flexibility and flexibility of the product in production. cost reduction

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