Grinding tool with single layer of diamond, and manufacturing method

A technology for grinding tools and manufacturing methods, applied in grinding devices, manufacturing tools, metal processing equipment, etc., can solve the problem of reducing the exposed height of abrasive particles and the chip space, affecting the grinding speed and quality, and the absence of strong chemical Combined with other problems, to achieve more regular arrangement, improve production efficiency, reduce supplementation or adjust the proportion of abrasive particles

Inactive Publication Date: 2006-12-06
XIAMEN CHIA PING DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Single-layer diamond grinding tools are mainly used in the dressing of soft porous materials, grinding of hard and brittle materials, and surface roughening of materials. At present, most of the single-layer diamond grinding tools used in China are electroplating or brazing methods. The abrasive particles are only embedded in the metal, and there is no strong chemical bond on the bonding surface between the metal and the abrasive, so the holding force is not strong
Since the abrasive particles are non-uniformly distributed on the surface of the substrate, the height of the abrasive particles protruding from the substrat

Method used

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  • Grinding tool with single layer of diamond, and manufacturing method
  • Grinding tool with single layer of diamond, and manufacturing method
  • Grinding tool with single layer of diamond, and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0038] Example one:

[0039] Reference figure 2 , Figure 4 , Picture 10 , A single-layer diamond grinding disc without anti-corrosion layer, the diamond abrasive particles 2 are fixed on the substrate 1 through the brazing layer 3, a layer of titanium carbide layer 21 is formed between the diamond abrasive particles 2 and the brazing layer 3, and the diamond abrasive 2 Arranged in an equilateral triangle, the exposed height is about 80% of the abrasive particles 2. The diamond abrasive particles 2 are diamond sand with a size of about 200 microns, and the brazing layer 3 is a copper alloy containing 11% by weight of titanium.

[0040] The grinding disc has good sharpness, good grinding effect, large chip holding capacity, and the service life of the tool is 1.5 to 2 times that of the existing tool.

[0041] Reference Figure 5 to Figure 9 , Its manufacturing process includes the following steps:

[0042] 1. Coat the adhesive layer 6 on the surface of the substrate 1 after cleani...

Example Embodiment

[0046] Embodiment two:

[0047] Referring to Figure 3, a single-layer diamond grinding tool is made according to the method of Example 1. A layer of anti-corrosion layer 4 is covered on diamond abrasive particles 2 and brazing layer 3. The anti-corrosion layer 4 is ceramic glaze with a thickness of 2 μm. Manufactured by physical vapor deposition method. The service life of the tool in an acid environment is more than 2.5 times that of existing grinding tools.

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PUM

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Abstract

A single-layer diamond grinding tool features that the abrasive particles are uniformly distributed on the surface of basic body in such manner that their exposed parts have a same height. Its preparing method features use of an air sucking mesh plate to uniformly arrange the abrasive particles on the surface of basic body.

Description

technical field [0001] The invention relates to a grinding tool and a manufacturing method thereof, in particular to a single-layer diamond grinding tool. Background technique [0002] Single-layer diamond grinding tools are mainly used in the dressing of soft porous materials, grinding of hard and brittle materials, and surface roughening of materials. At present, most of the single-layer diamond grinding tools used in China are electroplating or brazing methods. The abrasive particles are only embedded in the metal, and there is no strong chemical bond on the joint surface between the metal and the abrasive, so the holding force is not strong. Since the abrasive particles are non-uniformly distributed on the surface of the substrate, the height of the abrasive particles protruding from the substrate is different. In the grinding operation with heavy load, the force on the abrasive particles is uneven, and the more prominent abrasive particles will not only damage the workp...

Claims

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Application Information

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IPC IPC(8): B24D7/02B24D3/06B24D18/00
Inventor 陈铨祥
Owner XIAMEN CHIA PING DIAMOND IND CO LTD
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