Alkali development resin composition
A resin composition and developing technology, applied in photography, instruments, opto-mechanical equipment, etc., can solve the problems of insufficient sensitivity, difficult to obtain pattern shape and fine pattern, etc., and achieve the effect of excellent sensitivity
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Embodiment 1
[0132] [Example 1] Production of alkaline developable resin composition No. 1
[0133] Add 154g Adeka Rejin EP-4100E (manufactured by Asahi Denka Kogyo Co., Ltd.; bisphenol A epoxy resin with epoxy equivalent of 190; hereinafter also referred to as compound a-1), 55.2g YP-90LL (manufactured by Hydra Chemical Co., Ltd.; ring The content of terpene monophenol is 90%; the average molecular weight is 266 and the hydroxyl equivalent is 340; hereinafter also referred to as compound c) and 90.3g of propylene glycol monomethyl ether acetate, the temperature is raised to 115°C. 1.05 g of triphenylphosphine was slowly added, and stirred at 120°C for 4 hours. 194 g of propylene glycol monomethyl ether acetate was further added, and cooled to 50°C or below. After that, 0.26g of 2,6-di-tert-butyl-p-cresol, 2.6g of benzyltriethylammonium chloride and 46.8g of acrylic acid (hereinafter, also referred to as compound b) were added, and the temperature was raised to 120°C and maintained at 5 hou...
Embodiment 2
[0135] [Example 2] Production of alkaline developable resin composition No. 2
[0136] Add 171g of Adeka Regent EP-4100E (epoxy equivalent of 190; compound a-1), 25g of Epoxy 834 (manufactured by Nippon Epoxy Co., Ltd.: epoxy equivalent of 250; hereinafter also referred to as compound a-2) and 187g of YP -90LL (compound c), warm up to 115°C. 1.15g of triphenylphosphine was slowly added, and stirred at 120°C for 4 hours. Further, 617 g of propylene glycol monomethyl ether acetate was added and cooled to 50°C or below. Then, 0.415 g of 2,6-di-tert-butyl-p-cresol, 4.15 g of benzyltriethylammonium chloride, and 32.4 g of acrylic acid (compound b) were added, and the temperature was increased to 120°C and maintained for 5 hours. After cooling to 50°C or below, 88.2 g of phthalic dianhydride (compound d-1) and 0.289 g of tetrabutylammonium bromide were added, and the temperature was raised to 120°C and maintained for 4 hours. Cool to 40°C and keep for 60 hours. Add 564g of propylen...
Embodiment 3
[0138] [Example 3] Production of alkaline developable resin composition No. 3
[0139] Add 190 g of Epeco-To 834 (manufactured by Nippon Epoxy Co., Ltd.: epoxy equivalent 250; compound a-2) and 142 g of YP-90LL (compound c), and the temperature is increased to 115°C. Slowly add 1.00 g of triphenylphosphine, and stir at 120°C for 4 hours. Further add 521 g of propylene glycol monomethyl ether acetate, and cool to 50°C or below. After that, 0.358 g of 2,6-di-tert-butyl-p-cresol, 3.58 g of benzyltriethylammonium chloride, and 26.3 g of acrylic acid (compound b) were added, and the temperature was increased to 120°C and maintained for 5 hours. After cooling to 50°C or below, 67 g of phthalic dianhydride (compound d-1) and 0.22 g of tetrabutylammonium bromide were added, the temperature was raised to 120°C, and after stirring for 4 hours, it was cooled to 80°C. Then, 39.4 g of trimellitic anhydride (hereinafter also referred to as compound d-2) was added, the temperature was raised ...
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