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Liquid-jet head and liquid-jet apparatus, and methods for manufacturing the same

A technology of a droplet ejection head and a manufacturing method, applied in directions such as printing, can solve the problems such as the inability to ensure the gas sealing for substrate cooling and the limit of production capacity, and achieve the effects of increasing density, reducing flow channel resistance, and reducing deviation

Inactive Publication Date: 2007-01-24
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] When manufacturing the droplet ejection head of the above-mentioned structure, dry etching is used to form the members of the storage substrate, but when only dry etching is used, if the processing time, the number of substrates that can be performed at one time, etc. There is a limit in terms of production capacity
In addition, through-holes (holes) are formed on the memory substrate, but if there are through-holes on the substrate, the airtightness of the substrate-cooling gas filled with the support table on which the substrate is fixed cannot be ensured.

Method used

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  • Liquid-jet head and liquid-jet apparatus, and methods for manufacturing the same
  • Liquid-jet head and liquid-jet apparatus, and methods for manufacturing the same
  • Liquid-jet head and liquid-jet apparatus, and methods for manufacturing the same

Examples

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Embodiment 1

[0064] figure 1 It is an exploded view showing the droplet discharge head according to Embodiment 1 of the present invention. also, figure 2 is a cross-sectional view of the droplet ejection head. figure 1 and figure 2 Represents a part of the droplet ejection head (It should be noted that the components shown in the figure include figure 1 , figure 2 , in each of the following drawings, the dimensional relationship of each constituent member may be different from the actual one. In addition, the top of the figure is up, and the bottom is down, for explanation).

[0065] like figure 1 As shown, four substrates including the electrode substrate 2 , the chamber substrate 3 , the memory substrate 4 , and the nozzle substrate 5 are stacked in order from the bottom to constitute the droplet ejection head of this embodiment. Here, the electrode substrate 2 and the cavity substrate 3 are bonded by anodic bonding. In addition, the cavity substrate 3 and the memory substrate...

Embodiment 2

[0089] Figure 7 and Figure 8 It is a diagram showing the manufacturing steps of the memory substrate 4 of the droplet discharge head according to the second embodiment of the present invention. according to Figure 7 and Figure 8 , the method of manufacturing the memory substrate 4 of the second embodiment will be described.

[0090] Figure 9 It is a figure which shows the outline|summary of a non-contact exposure apparatus. Here, it is an exposure apparatus (sequential movement exposure apparatus) 80 capable of reduced exposure. exist Figure 9In the exposure device 80, the light emitted from the light source 81 is reflected by the mirror part 82, then condensed by the condensing lens part 83, and passes through the exposure mask 84 (reticle) for patterning the resist mask 72. 84, incident to the optical system component 85. The optical system part 85 has a condensing lens (not shown) for reducing, and reduces the patterned shape based on the exposure mask 84 by a...

Embodiment 3

[0098] Figure 10 It is a diagram showing the manufacturing steps of the memory substrate 4 of the droplet ejection head according to the third embodiment of the present invention. according to Figure 10 A method of manufacturing the memory substrate 4 will be described. Here, in this embodiment, also perform Figure 7 Steps from (a) to (e). In these steps, the same processing as that described in the second embodiment is performed, so the description is omitted.

[0099] Etching mask 91 made of silicon oxide deposited on the entire surface is formed by thermal oxidation. Resist patterning is then performed, and etching is performed with a hydrofluoric acid solution or the like to remove the etching mask 91 with respect to the portions corresponding to the nozzle communication holes 15 and the storage recesses 13a. Here, the portion corresponding to the nozzle communication hole 15 is removed so that the silicon substrate 71 is exposed to the C surface side and the N sur...

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Abstract

To provide a droplet delivery head that attains the improvement of throughput and the high yield by efficiently making a reservoir substrate with high accuracy, and to provide a manufacturing method therefor. The droplet delivery head comprises at least: a nozzle substrate 5 having a plurality of nozzle holes 16 delivering the droplets; a cavity substrate 3 having a plurality of delivery room first recesses 12a having a vibrating plate 11 and becoming a portion of a delivery chamber 12 in concert with the nozzle holes 16; and a reservoir substrate 4 that includes: a reservoir recess 13a having a plurality of supply ports 14 communicating with each delivery chamber 12 on the base and used as a reservoir 13 reserving the liquid supplied to the plurality of delivery room first recess 12a; a plurality of nozzle continuous holes 15 making the plurality of delivery chambers 12 communicate with the plurality of nozzle holes 16 respectively; and a plurality of delivery room second recesses 12b becoming the portion of the delivery chamber 12 on the contact surface side with the cavity substrate 3, wherein the cavity substrate 3 and the reservoir substrate 4 are joined, and thereby the delivery chamber 12 is formed by the delivery room first recesses 12a and the delivery room second recesses 12b.

Description

technical field [0001] The present invention relates to a method of manufacturing a droplet discharge head, a droplet discharge device having the droplet discharge head, and the like. Background technique [0002] The droplet ejection method (a representative method is an inkjet method used to eject ink and perform printing) is used in printing (printing) in any field regardless of household use or industrial use. The droplet ejection method is a method in which a liquid droplet ejection head having a plurality of nozzles, which is a fine processing element, is moved relative to an object, and a liquid is ejected at a predetermined position of the object. In recent years, in the manufacture of color filters for display devices using liquid crystals, display substrates using organic electroluminescence (OEL) elements, microarrays of biomolecules such as DNA, etc. use. [0003] As an ejection head realizing a droplet ejection method, there is at least one wall (here, a botto...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/14B41J2/045B41J2/16
Inventor 大谷和史
Owner SEIKO EPSON CORP
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