Alkaline silicon wafer polishing liquid

Abstract

The alkaline silicon wafer polishing fluid has pH 8-13 and grain size of 15-150 nm, and consists of abrasive 10-50 wt%, pH regulator 1-6 wt%, surfactant 0.01-0.6 wt%, and water 44-89 wt%. The alkaline silicon wafer polishing fluid possesses the advantages of no corrosion to the apparatus, easy cleaning after polishing, high silicon polishing speed, high polishing quality, high harmful metal ion chelating effect, no environmental pollution, low cost, etc.

Description

(1) Technical field:

[0001] The invention relates to an alkaline silicon wafer polishing liquid, in particular to a polishing liquid suitable for silicon substrate sheets, silicon original sheets and silicon diffusion sheets. (two) background technology:

[0002] In 1965, Monsanto Corporation of the United States first proposed the patent of silica sol and gel applied to the polishing process of silicon wafers in the world. Since then, the semiconductor slurry has become an important and indispensable auxiliary material in the semiconductor manufacturing industry. The semiconductor silicon wafer polishing process is an edge process connecting materials and device preparation, which greatly affects the yield of materials and devices, and shoulders the dual tasks of eliminating surface damage and contamination before processing and controlling induced secondary defects and impurities. Under the condition of specific polishing equipment, the polishing effect of silicon wafer d...