Alkaline silicon wafer polishing liquid

A technology for silicon wafers and polishing fluids, applied in the direction of polishing compositions containing abrasives, etc., can solve the problems of high prices and impact on the semiconductor industry, and achieve the effects of low cost, good commercial development prospects, and easy cleaning

Inactive Publication Date: 2007-04-11
天津晶岭电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Classified by PH value in the world, semiconductor silicon polishing liquid mainly has two types of slurry, namely acidic and alkaline, but generally expensive, which affects the devel

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1: a kind of alkaline silicon wafer polishing liquid, it is characterized in that its pH range is 8~13, and particle size is 15nm~150nm, and it is made up of abrasive material, pH adjusting agent, tensio-active agent and water.

[0015] The specific embodiment of above-mentioned silicon wafer polishing liquid is as follows:

[0016] To configure 10kg of polishing liquid, 2kg of abrasive silica sol, which accounts for 20% of the total mass, is required to be taken, and the particle size is 50nm. 200g of PH regulator potassium hydroxide with a mass of 2%, add 10g of activator FA / O series activators accounting for 0.1% of the total mass, 7.78kg of deionized water accounting for 77.8% of the total mass, and stir fully to obtain the present invention Polishing fluid.

[0017] Experimental detection results: the pH value of the polishing liquid is 10.6, and the particle size distribution is 50nm.

[0018] Speed ​​test: use the prepared polishing liquid on Fenglei...

Embodiment 2

[0020] Embodiment 2: a kind of alkaline silicon wafer polishing liquid, it is characterized in that its pH value range is 8~13, and particle size is 15nm~150nm, and it is made up of abrasive material, pH adjusting agent, surfactant and water mixing.

[0021] The concrete experimental scheme of above-mentioned silicon wafer polishing liquid is as follows:

[0022] To prepare 10kg of polishing fluid, it is necessary to take 30% of the total mass of CeO 2 Abrasive 3kg, particle diameter is 110nm, under the condition of stirring, add the alloying agent EDTA50g accounting for 0.5% of the total mass, then add 400g of the pH regulator tetrahydroxyethylethylenediamine accounting for 4% of the total mass, add 0.5% of the total mass 50 g of fatty alcohol polyoxyethylene ether and 6.5 kg of deionized water accounting for 65% of the total mass were stirred sufficiently to prepare the polishing solution of the present invention.

[0023] Experimental test results: the pH value of the poli...

Embodiment 3

[0027] An alkaline silicon wafer polishing solution is characterized in that its pH range is 8-13, and its particle size is 15nm-150nm. It is composed of abrasives, pH regulators, surfactants and water.

[0028] The concrete experimental scheme of above-mentioned silicon wafer polishing liquid is as follows:

[0029] To configure 10kg of polishing liquid, 3kg of silica sol abrasives accounting for 30% of the total mass, with a particle size of 70nm, are added under stirring conditions to add 100g of chelating agent with 13 chelating rings accounting for 1% of the total mass. 300g of PH regulator Tetrahydroxyethylethylenediamine, 50g of activating agent alkanol washing amine accounting for 0.5% of the total mass, and 65.5% of the total mass of deionized water were added to prepare the polishing solution of the present invention.

[0030] Experimental test results: the pH value of the polishing liquid is 11.4, and the particle size distribution is 70nm.

[0031] Speed ​​test: u...

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Abstract

The alkaline silicon wafer polishing fluid has pH 8-13 and grain size of 15-150 nm, and consists of abrasive 10-50 wt%, pH regulator 1-6 wt%, surfactant 0.01-0.6 wt%, and water 44-89 wt%. The alkaline silicon wafer polishing fluid possesses the advantages of no corrosion to the apparatus, easy cleaning after polishing, high silicon polishing speed, high polishing quality, high harmful metal ion chelating effect, no environmental pollution, low cost, etc.

Description

(1) Technical field: [0001] The invention relates to an alkaline silicon wafer polishing liquid, in particular to a polishing liquid suitable for silicon substrate sheets, silicon original sheets and silicon diffusion sheets. (two) background technology: [0002] In 1965, Monsanto Corporation of the United States first proposed the patent of silica sol and gel applied to the polishing process of silicon wafers in the world. Since then, the semiconductor slurry has become an important and indispensable auxiliary material in the semiconductor manufacturing industry. The semiconductor silicon wafer polishing process is an edge process connecting materials and device preparation, which greatly affects the yield of materials and devices, and shoulders the dual tasks of eliminating surface damage and contamination before processing and controlling induced secondary defects and impurities. Under the condition of specific polishing equipment, the polishing effect of silicon wafer d...

Claims

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Application Information

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IPC IPC(8): C09G1/02
Inventor 仲跻和
Owner 天津晶岭电子材料科技有限公司
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