Heat transfer apparatus, cooled electronic module and fabrication methods thereof

An electronic module and cooled technology, applied in cooling/ventilation/heating transformation, instrument cooling, circuit, etc., can solve problems such as interface thermal resistance

Inactive Publication Date: 2007-06-06
INT BUSINESS MASCH CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This connection will cause interfacial thermal resistance between the cooling device and the electronics

Method used

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  • Heat transfer apparatus, cooled electronic module and fabrication methods thereof
  • Heat transfer apparatus, cooled electronic module and fabrication methods thereof
  • Heat transfer apparatus, cooled electronic module and fabrication methods thereof

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Embodiment Construction

[0034] As used herein, "electronic equipment" includes any heat-generating electronic component of a computer system or other electronic system that requires cooling. In one example, an electronic device includes an integrated circuit chip. The term "cooled electronic module" includes any electronic module with a cooling function and at least one electronic device, and both single-chip modules and multi-chip modules are examples of electronic modules to be cooled. As used herein, "micro cooling structure" refers to a cooling structure with a feature size of 200 microns or less. A "composite" fin structure refers to any fin in which a first material having a first thermal conductivity is coated or wrapped with a second material having a second thermal conductivity. Each "material" may be a thermally conductive element or compound.

[0035] In general, there is provided an improved cooling device and method of making the same, which uses direct or indirect liquid coolant metho...

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Abstract

A heat transfer apparatus and method of fabrication are provided for facilitating transmission of heat from a heat generating electronic device. The heat transfer apparatus includes a thermally conductive base having a main surface, and a plurality of thermally conductive fins extending from the main surface. The thermally conductive fins are disposed to facilitate transfer of heat from the thermally conductive base, which can be a portion of the electronic device or a separate structure coupled to the electronic device. At least some conductive fins are composite structures, each including a first material coated with a second material, wherein the first material has a first thermal conductivity and the second material a second thermal conductivity. In one implementation, the thermally conductive fins are wire-bonded pin-fins, each being a discrete, looped pin-fin separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

Description

technical field [0001] The present invention relates to heat transfer mechanisms, and more particularly to heat transfer devices for removing heat generated by one or more electronic devices, cooled electronic modules and methods of manufacture thereof. More particularly, the present invention relates to heat transfer devices and methods using a plurality of thermally conductive composite fins, e.g. part of the device or connected to the electronic device. Background technique [0002] We all know that running electronic equipment generates heat. This heat must be efficiently removed from the device in order to maintain the junction temperature within the desired range, failure to remove the generated heat will cause the temperature of the device to increase, potentially creating thermal runaway problems. Several trends in the electronics industry are making thermal control—including removing heat from electronic devices, including technologies that have traditionally focu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/36G12B15/06
CPCH01L23/3677H01L2224/73253H01L23/473H01L2924/10253H01L2224/16225H01L23/4735H01L2924/00
Inventor M·K·延格尔R·E·西蒙斯R·C·楚M·J·小埃尔斯沃思L·A·坎贝尔R·R·施密特
Owner INT BUSINESS MASCH CORP
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