Thermosetting resin composition, sealing material for optical device and cured product
A resin composition, thermosetting technology, applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., can solve the problem of no record, and achieve the effect of excellent fracture resistance, high Tg, and high transparency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0051] Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to this.
[0052] The physical properties of the cured product were measured as follows.
[0053] Transparency: A mold whose inner surface was polished was used for curing, and a test piece having a thickness of 3 mm was produced, and the light transmittance (400 nm wavelength) before UV irradiation was measured according to JIS K-7105. A high light transmittance indicates excellent transparency.
[0054] Light fastness: using a Super Xenon Weather Meter (Super Xenon Weather Meter), at a black panel temperature of 63°C and a humidity of 50%, with an irradiation energy of 180W / m 2 The cured product was irradiated with UV light of 300 to 400 nm for 100 hours, and then the light transmittance was measured. Those with a small change in light transmittance before and after irradiation indicate excellent light resistance.
[0055] Tg: measured by TMA (thermomechanica...
manufacture example 1
[0058] Add 150 g of propylene glycol monomethyl ether acetate into a flask equipped with a stirrer, reflux cooling tube, dropping funnel, and thermometer, blow nitrogen into the gas phase, and control the temperature in the reaction system to 80°C for about 3 hours 150 g of propylene glycol monomethyl ether acetate and 300 g of (3,4-epoxycyclohexyl)methyl methacrylate [manufactured by Daicel Chemical Industry Co., Ltd. "CYCLOMER M100"] and 24 g of 2,2' A mixed solution of dimethyl azabisisobutyrate. After the dropwise addition was completed, the mixture was aged for 14 hours to complete the reaction. Then, low boiling point compounds were removed under reduced pressure to obtain 290 g of a radical polymer. The weight average molecular weight of the obtained radical polymer was 21,000, and the epoxy equivalent was 204.
manufacture example 2
[0060] In manufacture example 1, except having used 240 g of "CYCLOMER M100" and 60 g of n-butyl acrylates instead of 300 g of "CYCLOMER M100", it carried out similarly to manufacture example 1, and obtained 290 g of radical polymers. The weight average molecular weight of the obtained radical polymer was 23,000, and the epoxy equivalent was 257.
PUM
| Property | Measurement | Unit |
|---|---|---|
| glass transition temperature | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More