Multi-level dram trench store utilizing two capacitors and two plates

Abstract

A multi-level memory cell capable of storing two or three bits of digital data occupies only four lithographic squares and requires only one or two logic level voltage sources, respectively. High noise immunity derives from integration of the multi-level signal in the memory cell directly from logic level digital signals applied to two capacitors (as well as the bit line for the eight level mode of operation) by using capacitors having different values in order to avoid digital-to-analog conversion during writing. The capacitors can be simultaneously written and read to reduce memory cycle time. Transistor channels and capacitor connections are formed on adjacent semiconductor pillars using plugs of semiconductor material between pillars as common gate structures and connections. Opposite surfaces of the pillars also serve as storage nodes with common capacitor plates formed by conformal deposition between rows of plugs and pillars.

Description

[0001] 1. Field of the Invention[0002] The present invention generally relates to semiconductor storage structures and, more particularly, to dynamic random access memories of extremely high storage capacity fabricated on chips of limited size.[0003] 2. Description of the Prior Art[0004] It is generally recognized that increased integration density in integrated circuits (ICs) provides benefits in both improved performance and manufacturing economy. Increased proximity of devices formed on a chip reduces connection length and capacitance; reducing signal propagation time and increasing noise immunity. Increased noise immunity may, in turn, allow reduction in operating voltages which allows further scaling of devices to smaller sizes on the chip. Increased integration density also allows more devices to be formed on a chip of given size using common wafer processing steps, allowing more chips to be formed with improved uniformity without significant increase of cost. To obtain these ...

AI Technical Summary

Problems solved by technology

However, to advance from sixteen Megabit memory chips to the currently available sixty-four Megabit memory chips, little design development was available at the cell level and the increase in capacity was principally developed through reduced feature size regimes and increased chip area.

Consequently, some loss in manufacturing economy was encountered in the sixty-four Megabit generation of memory chips due principally to increased overhead of exposure systems capable of higher resolution and reduced number of chips per wafer.

While minimum feature size regimes of 0.1 micron and smaller are technically feasible at the present time and foreseeable for commercial production, to develop a further generation of memory chips having a capacity of 256 Megabits per chip or greater without a major improvement in memory cell design would clearly require an unacceptable chip size and economic cost while not fully realizing potential or particularly significant performance improvement.

However, to date, no such designs have been develop...

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