Socket for testing a semiconductor device and a connecting sheet used for the same

Abstract

Probes 1 for testing and outer connecting terminals 14a are electrically connected to a-test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes 202, flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheet 2 is exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.

Description

[0001] This application is a divisional of application Ser. No. 10 / 659,281, filed on Sep. 11, 2003, which is a continuation of application Ser. No. 09 / 686,981, filed on Oct. 17, 2000 (now abandon).FIELD OF THE INVENTION [0002] The present invention relates to a test socket used for testing electrical characteristics of semiconductor devices. DISCUSSION OF BACKGROUND [0003] In accordance with advancement of functions and miniaturization of electronic equipments, the number of outer connecting terminals of semiconductor devices are increased, a density of semiconductor device becomes high, and semiconductor packages such as a ball grid array (BGA) type, which is formed by arranging outer connecting terminals on a lower surface of a semiconductor device in a grid-like form, and a chip scale package (CSP) type are increasingly used instead of a QFP type formed by arranging outwardly drawn-out connecting terminals, or an SOP type semiconductor package. When such a semiconductor package i...

AI Technical Summary

Benefits of technology

[0013] It is an object of the present invention to solve the above-mentioned problems inherent in the conventional technique and to provide a test socket for semiconductor devices, which can stably and continuously realize sufficient electric contact between probes and outer connecting terminals.

[0030] According to a fifth aspect of the present invention, there is provided the test socket according to the fourth aspect of the invention, wherein the connecting sheet of the test socket has a connecting wire, which increases distances between the electrodes, being in contact with the outer connecting terminals of the semiconductor device, and is connected to the electrodes being in contact with the circuit board.

Problems solved by technology

Accordingly, it is difficult to arrange the probes 1 of the conventional test socket.

Therefore, a void is caused at time of mounting the outer connecting terminals to a printed circuit board and so on by melting the outer connecting terminals in use of reflow of solder, whereby a defect of blowhole is caused.

Further, as illustrated in FIG. 18, when remains 30 of solder adheres to and are deposited on a tip of a probe, the remains are oxidized in the atmosphere, and a contact resistance is increased by a coating of an oxide film 30a, there were problems that a semiconductor device could not be tested, and a function of the socket could not be demonstrated.

Further, there were problems that a contact resistance was increased by the coating of the oxide film, the semiconductor device could not be tested, and a function of the socket could not be demonstrated.

Further, it was necessary to spend a very long time and much labor for exchanging probes, selected as having high contact resistances or connection failures out of a large number, e.g. several hundreds, of the pin-like probes arranged in a grid-like form.

There was a problem that a cost becomes very high when a socket itself was changed because a unit price of the above-mentioned pin-like probe is high.

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