Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper

Abstract

In a method and apparatus for polishing a Cu metal layer and a method for forming Cu metal wiring, Cu oxide created by a surface oxidation of a Cu metal layer is removed from the wafer. The Cu metal layer, in which Cu oxide is removed, is polished. By polishing the Cu metal layer using the above method, process failures, such as scratches, caused by the presence of remnants of Cu oxide during subsequent polishing can be prevented.

Description

RELATED APPLICATIONS [0001] This application is a divisional of U.S. application Ser. No. 10 / 233,805, filed on Sep. 3, 2002, which relies for priority upon Korean Patent Application No. 01-58749, filed on Sep. 21, 2001, the contents of which are herein incorporated by reference in their entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a method and apparatus for polishing a copper (Cu) layer and a method for forming a wiring structure using Cu, and more particularly to a method for polishing a Cu layer formed by an electro-plating and annealing process, a polishing apparatus that is suitable for performing the polishing method, and a method for forming a wiring structure using Cu. [0004] 2. Description of the Related Art [0005] As information media, such as computers, continue to become more widely used, associated semiconductor technology must continue to advance. Functionally, semiconductor devices must operate at high sp...

AI Technical Summary

Benefits of technology

[0014] The present invention addresses the limitations of the conventional approaches. In this manner, a polishing system and method are provided for forming Cu wiring having improved planarization, while mitigating scratches during fabrication, and improving yield.

[0015] It is a first object of the present invention to provide a method for polishing a Cu metal layer capable of reducing process failure.

[0016] It is a second object of the present invention to provide an apparatus for polishing a Cu metal layer adapted for reducing process failure.

[0017] It is a third object of the present invention is to provide a method for forming a Cu metal wiring structure capable of reducing process failure.

[0021] In the apparatus and system of the present invention, the Cu oxide layer is removed prior to polishing, such that scratches or other failure-inducing features that would otherwise be caused by the presence of the Cu oxide layer can be mitigated or prevented.

Problems solved by technology

However, as semiconductor devices become more highly integrated, the aluminum wiring structure exhibits limitations such as a junction spike failure and electromigration.

However, Cu is rapidly diffused into silicon or other metal layers during processing.

Thus, a conventional photolithography process is not suitable for Cu wiring.

In addition, the polishing rate at each part of the silicon wafer varies depending on the corresponding thickness of the Cu oxide layer 18, so that the polishing uniformity is adversely affected.

However, it is very difficult to optimize the process condition such that the oxidation can be performed to an upper portion of the wiring, that is, to the very upper portion of the trench.

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