30results about How to "Reduce processing failure" patented technology

The invention discloses a method for machining spatial holes by using a large ellipsoid on a numerical control boring-milling machine. The method comprises the following steps of: determining the range and the clamping datum of a machined hole by applying a software analysis workpiece; compiling a numerical control machining program of the spatial hole; checking the numerical control machining program by applying simulation software; clamping and correcting according to a numerical control requirement and machining the spatial hole with an allowance; detecting the spatial position precision of the machined hole, adjusting the numerical control machining program according to a detection result and then machining the spatial hole to a required precision; and repeatedly clamping and machining a spatial hole in another range until holes on the workpiece are all machined. The invention has the advantages that multiple groups of spatial holes on the large ellipsoid can be machined by using a numerical control boring-milling machine, thereby meeting the requirement on the position precision; the maximum utilization ratio of a process is realized without being limited by the system of the numerical control boring-milling machine, and the compiling of the machining program can be finished only by updating part models and mathematical parameters; and the process is safe and reliable and has high efficiency.

In a method of filling a liquid crystal display panel with liquid crystal and a liquid crystal filling system using the method, a seal line and spacers are formed on a color filter substrate. A first volume defined by the seal line and a second volumes defined by the spacers are obtained. An amount of liquid crystal to be supplied into a region enclosed by the seal line is precisely calculated based on the first and second volumes. Shortage of the liquid crystal supplied into the LCD panel and overflow of the liquid crystal can be avoided. Accordingly, the steps for supplying the liquid crystal into the LCD panel may be reduced, and simultaneously peripheral regions of the LCD panel be prevented from being contaminated by the liquid crystal while the liquid crystal is filled into the LCD panel.

Disclosed is a method for growing a nitride-based semiconductor with high quality, the method including: forming a first mask layer on a substrate and forming a second mask layer on the first mask layer; performing dry etching on the first mask layer and the second mask layer to form an opening in which a part of the substrate is exposed; performing selective wet etching on the first mask layer in the opening to form a recess in which a part of the substrate is exposed; depositing a third mask layer in the recess; and growing a nitride-based semiconductor from the exposed part of the substrate on sides of the third mask layer and expanding the growth via the opening.

A closed chemical introduction system used to deliver active ingredients in liquid chemical to a chemical vapor deposition system includes a robust, moisture-free cartridge containing a defined dose of liquid chemical. The cartridge is placed on a mounting slot specially configured to receive the cartridge. Upon initiating the system, a first linear mechanical actuator securely holds the cartridge in the slot, while an extraction lance attached to a second linear mechanical actuator punctures the cartridge from the bottom, extracts the liquid chemical and delivers it to a vaporization chamber. The vaporization chamber evaporates the liquid chemical and delivers the vapors containing the active ingredients to the chemical vapor deposition system. The chemical vapor deposition system may include a treatment chamber, a conveyor, a compressed clean air system to provide separate treatment compartments within the chamber, a moisture system, a chemical vapor system, and a neutralization system to neutralize harmful byproducts.

The invention relates to the technical field of friction welding, in particular to a friction welding machine capable of rolling and leveling a workpiece. The friction welding machine comprises a mounting frame mechanism, wherein the mounting frame mechanism comprises a base, a first mounting frame is fixed to the top end of the base, a second mounting frame is fixed to the position, located at one side of the first mounting frame, of the top end of the base, and a third mounting frame is fixed to the position, located at one side of the second mounting frame, of the top end of the base; and adriving motor is installed at the top end of the third mounting frame, the output end of the driving motor is connected with a second clamping mechanism, and an eccentric mechanism is connected to the position, located on the outer wall of the second clamping mechanism, of the top end of the second mounting frame. According to the friction welding machine, through the arrangement of a connectingmechanism and a grinding mechanism, a grinding head can be rapidly mounted or dismounted through the connecting mechanism, the process is convenient, and after welding is completed through the grinding mechanism, a weld joint can be rapidly ground, the purpose of rolling leveling after welding is completed is achieved, the machining difficulty needed by the workpiece is reduced, and therefore theproduction cost is reduced.

A method for improving a misalignment of a printed circuit board and a liquid crystal display device with the printed circuit board are disclosed. A printed circuit board having a substrate and PCB lands formed at a portion of the substrate in the horizontal direction is provided and a tape carrier package having TCP leads corresponding to the PCB lands is also provided. The intervals among the PCB lands are amended by the thermal expansion amount of the substrate. After the printed circuit board and the tape carrier package are aligned, the printed circuit board and the tape carrier package are connected to each other by the thermo-compression bonding process. The misalignment due to the thermo-compression bonding process can be improved, decreasing the processing failures and increasing the productivity.

The present invention discloses a piping design for a high density plasma process chamber, wherein an extra pipe is added to between a process chamber and a mass flow controller, and the extra pipe together with a pump is used to drain out the gas, which cannot be monitored by the mass flow controller and survives in a gas injection pipe, lest the remaining gas pollute the deposited film or react with the process gas to induce an explosion in the succeeding deposition process.

The present disclosure relates to manufacturing techniques and respective semiconductor devices in which the capping material of gate electrode structures may be removed together with portions of the capping material of resistors on the basis of a highly controllable directional etch process, wherein raised drain and source regions may be protected on the basis of a fill material.

A processing method of a workpiece with a circular disc shape includes sticking a tape to one surface of the workpiece and integrating the workpiece and a frame through the tape, holding the workpiece by a holding unit with the interposition of the tape, and irradiating the other surface of the workpiece located on the opposite side to the one surface with a pulsed laser beam having such a wavelength as to be absorbed by the workpiece from the side of the other surface. In irradiating the laser beam, the other surface is annularly irradiated with the laser beam in the state in which the orientation of the laser beam is adjusted in such a manner that the laser beam has an angle of incidence formed due to inclination with respect to a normal to the other surface of the workpiece by a predetermined angle.