Pixel for CMOS image sensor having a select shape for low pixel crosstalk

Inactive Publication Date: 2006-02-16
CROSSTEK CAPITAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014] Use of a square image sensing area increases the distance between image sensing areas of adjacent pixels. This leads to a reduction in electrical and color crosstalk and improves the modulation transfer function (MTF).
[0015] In a second aspect of the invention, hemispherically-shaped microlenses are positioned over the image sensing areas o

Problems solved by technology

First, CCD imagers require specialized facilities, which are dedicated exclusively to the fabrication of CCDs.
Second, CCD imagers consume a substantial amount of power, since they are essentially capacitive devices, which require external control signals and large clock swings to achieve acceptable charge transfer efficiencies.
Third, CCD imagers require several support chips to operate the device, condition the image signal, perform post processing and generate standard video output.
This need for additional support circuitry makes CCD systems complex.
Finally, CCD systems require numerous power supplies, clock drivers and voltage regulators, which not only further increase the complexity of the design, but also demands the consumption of additional significant amounts of power.
Despite the improvement in effective fill factor using hemicylindrically-shaped microlenses, there are negative performance factors, which are attributable to use of rectangular-shaped image sensing

Method used

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  • Pixel for CMOS image sensor having a select shape for low pixel crosstalk
  • Pixel for CMOS image sensor having a select shape for low pixel crosstalk
  • Pixel for CMOS image sensor having a select shape for low pixel crosstalk

Examples

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Example

[0024] Referring to FIG. 3, there is shown a layout view of a specific embodiment of a unit pixel 30 for a CMOS image sensor according to the present invention. Unit pixel 30 is comprised of a square-shaped image sensing area 300, transfer transistor 302, floating node 304, reset transistor 306, drive transistor 308, select transistor 310 and output 312. Unit pixel 30 is powered by power supply VDD 314.

[0025] Unlike the rectangular-shaped image sensing area 100 of the unit pixel 10 for the CMOS image sensor of FIG. 1, the image sensing area 300 of the embodiment of FIG. 3, is square-shaped. And, as shown in the exemplary embodiment of FIG. 4, the image sensing areas 400 for an array 40 of unit pixels 30, have an area of, for example, about 8×8 μm2. The spacing between neighboring image sensing areas 400 is, for example, around 4 μm, which is an improvement in separation of approximately 3.2 μm compared to the spacing between neighboring pixels using rectangularly-shaped image sensi...

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Abstract

A novel CMOS image unit pixel layout having a photodiode including an optically optimized square image sensing region. The square image sensing layout provides for reduced electrical and color crosstalk and improved modulation transfer function (MTF) between neighboring pixels of an array of pixels.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates generally to image sensing technology. More specifically, the present invention relates to a CMOS image sensor having a novel layout that uses specially-matched microlenses. [0002] Traditionally, imaging technology has been centered around charge coupled device (CCD) image sensors. However, recently, CMOS imaging technology has become increasingly the technology of choice. There are a variety of reasons for this progression. First, CCD imagers require specialized facilities, which are dedicated exclusively to the fabrication of CCDs. Second, CCD imagers consume a substantial amount of power, since they are essentially capacitive devices, which require external control signals and large clock swings to achieve acceptable charge transfer efficiencies. Third, CCD imagers require several support chips to operate the device, condition the image signal, perform post processing and generate standard video output. This need fo...

Claims

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Application Information

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IPC IPC(8): H04N5/335H01L27/146G02B3/00H04N5/359H04N5/374
CPCH01L27/14603H01L27/14609H04N5/335H01L27/14645H01L27/14627H04N25/00H01L27/146
Inventor LEE, DO-YOUNG
Owner CROSSTEK CAPITAL
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