Sandwiched thermal article

Abstract

A thermal material for heat dissipation, which includes at least one sheet of flexible graphite sandwiched about a non-graphite core layer.

Description

TECHNICAL FIELD [0001] The present invention relates to a sandwiched structure having an isotropic core and being capable of use as a thermal spreader or a finstock in the manufacture of heat sinks and other thermal dissipation devices. By thermal spreader is meant a material or article that functions to spread heat from a heat source over an area greater than one or more of the surfaces of the heat source; by finstock is meant a material or article that can be utilized as, or to form, fins used to dissipate heat. BACKGROUND OF THE INVENTION [0002] With the development of more and more sophisticated electronic devices, including those capable of increasing processing speeds and higher frequencies, having smaller size and more complicated power requirements, and exhibiting other technological advances, such as microprocessors and integrated circuits in electronic and electrical components, high capacity and response memory components such as hard drives, electromagnetic sources such ...

AI Technical Summary

Benefits of technology

[0025] Accordingly, it is an object of the present invention to provide an improved thermal solution for facilitating the dissipation or spreading of heat from a component of an electronic device.

[0026] Still another object of the present invention is the provision of a thermal solution having a sufficiently high thermal anisotropic ratio to function effectively for heat dissipation from a heat collection article or material.

[0027] Yet another object of the present invention is the provision of a formable thermal solution which provides heat dissipation in an environment where available space is otherwise impractical.

Problems solved by technology

However, microprocessors, integrated circuits and other sophisticated electronic components typically operate efficiently only under a certain range of threshold temperatures.

The excessive heat generated during operation of these components can not only harm their own performance, but can also degrade the performance and reliability of the overall system and can even cause system failure.

The increasingly wide range of environmental conditions, including temperature extremes, in which electronic systems are expected to operate, exacerbates the negative effects of excessive heat.

However, the flexible nature of graphite materials makes it difficult to form complex structures or shapes unless the materials are first impregnated with a resin or the like.

In addition, the attachment of graphite fins to metallic bases is also problematic, since graphite cannot be soldered into place in the same way metallic fins can.

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