Method of manufacturing a semiconductor device with different lattice properties
a manufacturing method and technology of semiconductor devices, applied in the direction of semiconductor devices, electrical devices, transistors, etc., can solve the problems of reducing the processing time of transistors, reducing the time needed for electrons to pass, and cmos transistor manufacturing techniques are difficult to meet the needs of cmos transistors, so as to improve the electron mobility in the channel and reduce current loss.
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[0028] The invention now will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are described. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout. The relative thickness of layers in the illustrations may be exaggerated for purposes of describing the invention.
[0029] FIGS. 2 to 7 are exemplary views illustrating a method of manufacturing a semiconductor device according to embodiments of the invention. In FIG. 2, the first semiconductor layer 110 is formed on the semiconductor substrate 100. In FIG. 3, the second semiconductor layer 120 is formed on first semiconductor layer 110. The second semiconduc...
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