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Apparatus for and method of processing substrate subjected to exposure process

a technology of substrate and exposure process, applied in the direction of photomechanical apparatus, instruments, printing, etc., can solve the problems of line width variation and no particular consideration of controlling this time interval, and achieve the effect of improving the uniformity of line width of a pattern

Inactive Publication Date: 2007-03-15
SOKUDO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] This provides a uniform processing history for the substrates, thereby further improving the line width uniformity of a pattern.
[0012] This provides a uniform processing history for the substrates easily with reliability.
[0014] It is therefore an object of the present invention to provide an apparatus for and a method of processing a substrate which are capable of further improving the line width uniformity of a pattern.

Problems solved by technology

Unfortunately, some variations in line width still occur even if the time interval between the end of the exposure process and the start of the post-exposure bake process is made constant.
However, no particular consideration has conventionally been given to controlling this time interval.

Method used

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  • Apparatus for and method of processing substrate subjected to exposure process
  • Apparatus for and method of processing substrate subjected to exposure process

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Embodiment Construction

[0029] A preferred embodiment according to the present invention will now be described in detail with reference to the drawings.

[0030]FIG. 1 is a plan view of a substrate processing apparatus according to the present invention. FIG. 2 is a front view of a liquid processing part in the substrate processing apparatus. FIG. 3 is a front view of a thermal processing part in the substrate processing apparatus. FIG. 4 is a view showing a construction around substrate rest parts. An XYZ rectangular coordinate system in which an XY plane is defined as the horizontal plane and a Z axis is defined to extend in the vertical direction is additionally shown in FIG. 1 and the subsequent figures for purposes of clarifying the directional relationship therebetween.

[0031] The substrate processing apparatus according to the preferred embodiment is an apparatus (a so-called coater-and-developer) for forming an anti-reflective film and a photoresist film on substrates such as semiconductor wafers by ...

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Abstract

A substrate subjected to an exposure process by an exposure unit is transported into a cleaning processing unit in a substrate processing apparatus. An adjustment is made to the presence time (more specifically, the waiting time or the cleaning time) of the exposed substrate in the cleaning processing unit to adjust the instant of the end of a cleaning process so as to provide a constant time interval between the instant of the completion of the exposure process and the instant of the end of the cleaning process. Such adjustments provide a constant time interval between the instant of the completion of the exposure process and the instant of the start of a post-exposure bake process, and also provide a constant time interval between the, instant of the completion of the cleaning process and the instant of the start of the post-exposure bake process. This achieves further improvements in the line width uniformity of a pattern formed when a chemically amplified resist is used.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method of processing a substrate such as a semiconductor substrate subjected to an exposure process, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk and the like, and a substrate processing apparatus for executing the method. [0003] 2. Description of the Background Art [0004] As is well known, semiconductor and liquid crystal display products and the like are fabricated by performing a series of processes including cleaning, resist coating, exposure, development, etching, interlayer insulation film formation, heat treatment, dicing and the like on the above-mentioned substrate. An apparatus which performs a resist coating process on a substrate to transfer the substrate to an exposure unit and which receives an exposed substrate from the exposure unit to perform a development process on the exposed substrate,...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G03B27/42G03C5/00G03F7/38H01L21/027H01L21/304H01L21/677
CPCG03F7/70991G03F7/38
Inventor HAMADA, TETSUYA
Owner SOKUDO CO LTD
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