49results about How to "Improve line width uniformity" patented technology

A positive resist composition comprising: a resin that comprises a repeating unit including a specific norbornane lactone structure and a repeating unit including a specific alicyclic hydrocarbon structure, and that increases a solubility of the resin in an alkaline developer by an action of an acid; and a compound that generates an acid upon treatment with one of an actinic ray and radiation, and a pattern forming method utilizing the same.

A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film having a receding contact angle of 70 degrees or above with respect to water, wherein the resist composition for negative development contains a resin capable of increasing the polarity by the action of an acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) exposing the resist film via an immersion medium, and (c) performing development with a negative developer.

A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film having a receding contact angle of 70 degrees or above with respect to water, wherein the resist composition for negative development contains a resin capable of increasing the polarity by the action of an acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) exposing the resist film via an immersion medium, and (c) performing development with a negative developer.

The wafer coated with the resist is deliberately placed in the vapor before being transferred to an aligner that exposes the resist on the wafer, the vapor, for example, the moisture, uniformly adheres onto the resist on the wafer. As a result, the substrate can uniformly be exposed in the following exposing process, and the uniformity of the line width and the like can be improved.

When a first substrate transferred outwardly from an indexer cell is the last substrate prior to reticle change in an exposure apparatus, the outward transfer of a second substrate to be processed subsequently to the first substrate from the indexer cell is temporarily stopped. After a lapse of time corresponding to reticle replacement time, the outward substrate transfer is restarted, and the second substrate is transferred outwardly from the indexer cell. For the exposure apparatus, the second substrate subjected to a resist coating process is received at the instant when the reticle replacement is completed after the completion of the exposure process of the first substrate. This provides a constant time interval between the completion of the resist coating process of substrates and the execution of the exposure process thereof without the decrease in processing efficiency. As a result, a uniform processing history for the substrates is achieved to further improve the line width uniformity of a pattern.

The invention discloses an exposure device and an exposure system. The exposure equipment includes a pedestal and a base platform located above the base for carrying the substrate, and it is characterized in that the exposure equipment further includes a base set between the base and the base platform for adjusting the base Curvature or / and temperature adjustment of the table. In this exposure equipment, the curvature or / and temperature of the base platform can be adjusted through the adjustment device, so that the curvature of the surface of the base platform is consistent with the bending deformation of the mask plate, so that the curvature of the substrate to be exposed will also be consistent with the curvature of the mask plate The deformation phase is consistent, so that the gap between the lower surface of the mask plate at different positions and the upper surface of the substrate is consistent; or / and, the temperature at different positions of the base can be adjusted through the adjustment device, so that the temperature at different positions of the substrate remains consistent, thereby improving exposure Linewidth uniformity at different locations on the substrate.

The present invention relates to an array substrate, a manufacturing method thereof, and a display device. The array substrate includes: gate lines, common electrode lines, and data lines disposed on a substrate; The first spacer layer between the common electrode line and the data line, the first spacer layer extends to at least one side in the width direction of the data line for a predetermined length; and / or is arranged in the overlapping area of ​​the gate line and the data line, and is located A second spacer layer between the gate line and the data line, the second spacer layer extends to at least one side in the width direction of the data line for a predetermined length. By setting the first spacer layer and / or the second spacer layer, when exposing the data line metal layer, the data caused by the difference in light reflectance between the common electrode layer metal and / or the gate line layer metal and the data line layer metal can be reduced. The difference in line width can improve the uniformity of data line width, reduce the risk of data line disconnection, and improve product yield.

A positive resist composition and a pattern forming method using the resist composition are provided, the resist composition including: (A) a resin containing a repeating structural unit represented by formula (I) as defined in the specification and being capable of decomposing by an action of an acid to increase the solubility in an alkali developer; (B) an acid generator; and (C) a mixed solvent containing at least one solvent selected from the group consisting of the following Group (a) and at least one solvent selected from the group consisting of the following Groups (b) to (d):Group (a): an alkylene glycol monoalkyl ether,Group (b): an alkylene glycol monoalkyl ether carboxylate,Group (c): a linear ketone, a branched chain ketone, a cyclic ketone, a lactone and an alkylene carbonate, andGroup (d): a lactic acid ester, an acetic acid ester and an alkoxypropionic acid ester.