Substrate processing method and substrate processing apparatus
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Publication Date
- 2005-06-16
- Estimated Expiration
- Not applicable · inactive patent
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a substrate processing apparatus for coating a semiconductor wafer with a resist and developing thereof in a fabrication of semiconductor device. In detail, the invention relates to a substrate processing apparatus that controls the atmosphere of the processing environment of the substrate.
[0003] 2. Description of the Related Art
[0004] In a process of photolithography in the semiconductor device fabrication, the surface of a semiconductor wafer (hereinafter referred to as “a wafer”) is coated with a photo-resist, exposing a mask pattern on the resist, then developing thereof, forming a resist pattern on the wafer surface. The resist coating and development are performed in an integrated coating and developing processing apparatus including a thermal processing apparatus such as a heating processing apparatus or a cooling processing apparatus. The coating and developing apparatus is...