Unlock instant, AI-driven research and patent intelligence for your innovation.

Pad Conditioner and Method for Making the Same

a technology of conditioner and pad, which is applied in the field of making a pad conditioner, can solve the problems of high defectivity, large height variation of the top end and large deviation of the height of the diamond abrasive grain relative to the substrate surfa

Inactive Publication Date: 2009-02-12
YEN TIEN YUAN
View PDF5 Cites 37 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a method for making a pad conditioner that overcomes the drawbacks of prior art. The method involves forming a substrate with recesses containing diamond abrasive grains, which are then bonded to the substrate. The diamond abrasive grains are positioned in the recesses in a way that their cutting portion is received in the recess and their retained portion protrudes outwardly of the substrate. The resulting pad conditioner has improved performance and efficiency."

Problems solved by technology

However, orientations of the diamond abrasive grains on the substrate surface are randomly disposed using the patterned template or sieve, which results in large height variations for top ends of the diamond abrasive grains relative to the substrate surface.
Consequently, grooves formed in the polishing pad through the diamond abrasive grains of the conventional pad conditioner have various depths relative to the surface, which causes problems, such as polishing uniformity, high defectivity, and short service life.
In addition, since the height difference is large, only a small portion of the diamond abrasive grains (i.e., working diamonds) are effective in forming the grooves in the polishing pad, which causes excessive wearing for the small portion of the diamond abrasive grains, and which results in a decrease in the cutting rate for forming the grooves in the polishing pad.
On the contrary, since the grooves formed by the {111} and {100} faces 911, 912 of the diamond abrasive grain 4 are wide and shallow, the pad asperities of the polishing pad 81 thus formed are thin and have a weak mechanical strength, thereby resulting in a decrease in the material removal rate and an increase in the defectivity.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pad Conditioner and Method for Making the Same
  • Pad Conditioner and Method for Making the Same
  • Pad Conditioner and Method for Making the Same

Examples

Experimental program
Comparison scheme
Effect test

example

Example 1

[0045]A die 2 made by wire cutting techniques was provided to imprint a plastic substrate 11 so as to form a plurality of pyramidal recesses 12 therein (FIGS. 3-5). The die 2 was made from a stainless steel plate 21 that was formed with a plurality of right pyramids 22 protruding from a die surface 211 of the stainless steel plate 21 having a diameter of 110 mm and a thickness of 30 mm. The right pyramids 22 were distributed over a region with a diameter of 100 mm on the die surface 211. The distance between tip ends 221 of each two adjacent ones of the right pyramids 22 was 700 μm. The tip end 221 of each of the right pyramids 22 defined an angle of about 90° and a height of 350 μm relative to the die surface 211. The plastic substrate 11 was made from polypropylene, and had a diameter of 110 mm and a thickness of 0.4 mm. A pressure of 10 MPa was applied on the die 2 to imprint the plastic substrate 11 so as to form about 15785 pyramidal recesses 12, each of which defined ...

example 2

[0062]The pad conditioner 100 of Example 2 was prepared by steps similar to those of Example 1, except that the height 311 of the adhesive 31 relative to the sharp closed end 121 of the recess 12 was about 150 μm (see FIG. 8).

[0063]FIG. 16 is a microscope image showing a configuration of the pad conditioner 100 of Example 2 at 60× magnification. Since the height 311 of the adhesive 31 in the recess 12 of Example 2 was higher than that of Example 1, the height of the protrusions 61 of Example 2 was smaller than that of Example 1. By examining about 1000 diamond abrasive grains 4 of the pad conditioner 100 via observing the microscope image, the number of the diamond abrasive grains 4 with the sharp corners 913, 914 as the top ends was 810, i.e., the percentage of the number of the diamond abrasive grains 4 with the sharp corners 913, 914 as the top ends was 81%.

[0064]FIG. 17 is a surface profile measuring graph showing the heights 44 of a portion of the diamond abrasive grains 4 of E...

example 3

[0065]The pad conditioner 100 of Example 3 was prepared by steps similar to those of Example 1, except for the manners of making the plastic substrate 11 and filling the adhesive 31.

[0066]The die 2 was formed by V-shaped groove grinding machining techniques, in which an annular region (which has an inner radius of 23.6 mm and an outer radius of 51.3 mm) of a stainless steel (SUS420) body was cut and ground from three directions (each direction pair forming an angle of 120 degrees) so as to form a plurality of V-shaped grooves in each direction. The distance between each two adjacent ones of the V-shaped grooves was 1.23 mm. The grinding angle was 70.52°. The depth 122 of the V-shaped grooves was about 0.577 mm.

[0067]A pressure of 10 MPa was then applied on the die 2 thus formed to imprint the plastic substrate 11 (polypropylene), which had a diameter of 110 mm and a thickness of 1.0 mm, so as to form 7192 right-cone recesses 12 therein, each of which defined an angle of 90°, and a d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
angleaaaaaaaaaa
average heightaaaaaaaaaa
angleaaaaaaaaaa
Login to View More

Abstract

A method for making a pad conditioner, includes: (a) providing a first substrate having a grain-mounting surface, and a plurality of diamond abrasive grains, each of which has a retained portion and a cutting portion with at least one sharp corner; (b) forming a plurality of recesses in the first substrate, each of the recesses having a sharp closed end and an enlarged open end, and diverging from the sharp closed end to the enlarged open end in a manner to have a shape corresponding to that of the sharp corner of each of the diamond abrasive grains; (c) disposing each of the diamond abrasive grains in a respective one of the recesses; (d) forming a second substrate on the grain-mounting surface of the first substrate; and (e) removing the first substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority of Taiwanese application no. 096129008, filed on Aug. 7, 2007.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]This invention relates to a method for making a pad conditioner, more particularly to a method involving forming pyramid and / or frusto-pyramid recesses for receiving sharp corners of diamond abrasive grains therein, respectively.[0004]2. Description of the Related Art[0005]Chemical Mechanical Polishing (CMP) is a well-known method that can effectively and reliably achieve global planarization of a wafer surface for under 0.5 μm technology. The growth of CMP techniques is attributed to a need to solve a light-focus problem of photolithography resulting from miniaturization of ICs, and to an increase in the number of layers of a multi-layered structure in ICs.[0006]Performance of a CMP process is mainly affected by a pad conditioner, which is used to condition a polishing pad, i.e., to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B24D11/00B24B53/12
CPCB24D18/00B24B53/12
Inventor YEN, TIEN-YUAN
Owner YEN TIEN YUAN