Electronic device packaging and curable resin composition
a technology of curable resin and electronic devices, applied in the direction of resistive material coating, solid-state devices, metallic material coating processes, etc., can solve the problems of disturbing packaging of electronic devices with a more increased density, and particularly troublesome production of damage portions in wiring copper layers
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reference example 1
Production of Polyimide-Siloxane
[0088]In a 500 ml-volume glass flask were heated to 180° C. under stirring 58.84 g (0.2 mol) of 2,3,3′,4′-biphenyltetracarboxylic dianhydride and 120 g of triglyme (solvent) under nitrogen gas atmosphere. To the reaction mixture were added 154.7 g (0.17 mol) of α,ω-bis(3-aminopropyl)polydimethylsiloxane (amino equivalent: 455) and 70 g of triglyme, and the resulting mixture was further heated to 180° C. for 60 minutes. To thus obtained reaction mixture were added 8.59 g (0.03 mol) of bis(3-carboxy-4-aminophenyl)methane and 23.4 g of triglyme, and the resulting mixture was further heated to 180° C. for 5 hours. Thus obtained reaction mixture was filtered, to give a polyimide-siloxane solution of ηinh of 0.18 having a solid content (polymer content) of 50 wt. %. The imidation ratio is almost 100%. The obtained polyimide-siloxane solution was named polyimide-siloxane solution A.
reference example 2
Production of Polyimide-Siloxane
[0089]In a 500 mL-volume glass flask were heated to 180° C. under stirring 58.84 g (0.2 mol) of 2,3,3′,4′-biphenyltetracarboxylic dianhydride and 170 g of triglyme (solvent) under nitrogen gas atmosphere. The reaction mixture were cooled to approx. 100° C., and to this were added 127.4 g (0.14 mol) of α,ω-bis(3-aminopropyl)polydimethylsiloxane (amino equivalent: 455) and 50 g of triglyme, and the resulting mixture was further heated to 180° C. for 60 minutes. Thus obtained reaction mixture was cooled to room temperature, and to this were added 13.52 g (0.03 mol) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 4.56 g (0.03 mol) of 3,5-diaminobenzoic acid, and 79 g of triglyme, and the resulting mixture was further heated to 180° C. for 5 hours. Thus obtained reaction mixture was filtered, to give a polyimide-siloxane solution of ηinh of 0.20 having a solid content (polymer content) of 40 wt. %. The imidation ratio is almost 100%. The obtained polyimide-si...
example 1
[0090]In a glass vessel, the following components were stirred to give a uniform polyimide-siloxane solution composition (solution viscosity: 360 poises):
[0091]polyimide-siloxane solution A: 100 parts in terms of solid content;
[0092]Epikote 1007 (epoxy equivalent: 2,000): 10 parts;
[0093]DBU (tertiary amine): 2 parts;
[0094]silicone antifoaming agent: 4 parts;
[0095]Aerogil 50 (micropowdery silica): 15.8 parts;
[0096]Aerogil 130 (micropowdery silica): 1.8 parts;
[0097]barium sulfate: 44 parts;
[0098]talc: 11 parts;
[0099]mica: 11 parts.
[0100]The polyimide-siloxane solution composition showed little viscosity change after keeping at approx. 5° C. for 2 weeks and can be printing by screen-printing procedure.
[0101]The polyimide-siloxane solution composition was cured by heating to 120° C., and showed an electric insulation of 5×1013 Ω·cm (volume resistance).
[0102]A polyimide-siloxane solution composition containing no filler components was prepared and cured at 120° C. to give a cured sheet (...
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