Copper plating method and apparatus for a gravure cylinder

a gravure cylinder and copper plating technology, applied in the direction of printing, electrolysis processes, electrolysis components, etc., can solve the problems of reducing affecting the service life of the gravure cylinder, so as to reduce the consumption of additives and reduce the power supply cost. , the effect of uniform thickness

Inactive Publication Date: 2009-04-16
THINK LABORATORY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0021]The present invention can exhibit the remarkable effect of providing a copper plating method and apparatus for a gravure cylinder, in which copper plating with more uniform thickness can be provided over the full length of a gravure cylinder without causing defects such as rashes and pits irrespective of the size of the gravure cylinder, the concentration of a copper plating solution can be managed automatically, the consumption amount of additives can be reduced, a plating treatment can be performed within a short period of time, a power supply cost can be reduced, and handling is easy with excellent visibility.

Problems solved by technology

Due to the impurities contained in the ball inevitably, anode sludge is generated during a plating treatment, which causes defects such as rashes (minute protrusions) and pits (pinholes) on the outer peripheral surface of the gravure cylinder.
Although there is a phosphorus-containing copper ball of high purity for producing a semiconductor and the like, such a ball is expensive and is not adopted for a gravure cylinder in terms of cost-efficiency.
Furthermore, in order to prevent the dissolution amount of a phosphorus-containing ball in a copper plating solution from increasing excessively to enhance the copper ion concentration, making it impossible to perform an appropriate plating treatment, it is also necessary to dilute the solution by removing a plating solution periodically, thereby adjusting the copper ion concentration appropriately and disposing a waste liquid.
According to the above-mentioned method and apparatus, anode sludge is not generated so that defects such as rashes and pits are not caused, however, there is still a problem that the peripheral surface in the vicinity of both ends of a gravure cylinder is plated thickly.
However, even with the above proposal, there are the following problems.
Since a current density is about 15 to 20 A / dm2 and a voltage is 10 to 15 V for the purpose of preventing a burn, a plating treatment takes a long time, which results in a large power supply cost.
The uniformity of a plating thickness is insufficient.
Since the insoluble anode is positioned below the gravure cylinder, visibility is poor, and operability is poor.

Method used

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  • Copper plating method and apparatus for a gravure cylinder
  • Copper plating method and apparatus for a gravure cylinder
  • Copper plating method and apparatus for a gravure cylinder

Examples

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example 1

[0043]As a gravure cylinder, a cylindrical base with an aluminum core having a circumference of a circle of 450 mm and a full length of 1100 mm was used. The gravure cylinder was placed in a plating bath under the condition that both ends of the gravure cylinder were chucked. Anode chambers were brought close to gravure cylinder side surfaces up to an interval of 20 mm with a slide mechanism controlled by a computer, and the copper plating solution was overflowed, whereby the gravure cylinder was soaked completely. With the rotation speed of the gravure cylinder being set to be 120 ppm, copper plating was provided at a liquid temperature of 40° C., a current density of 18 A / dm2, and a voltage of 5.4 V until the thickness became 80 μm. The time required for a plating treatment was about 20 minutes. There were no rashes and pits on a plating surface, and plating with a uniform thickness was provided over the full length of the gravure cylinder. Furthermore, the copper plating solution...

example 2

[0044]As a gravure cylinder, a cylindrical base with an aluminum core having a circumference of a circle of 600 mm and a full length of 1100 mm was used. The gravure cylinder was placed in a plating bath. Anode chambers were brought close to the gravure cylinder up to an interval of 20 mm with a slide mechanism controlled by a computer, and the plating solution was overflowed, whereby the gravure cylinder was soaked completely. With the rotation speed of the gravure cylinder being set to be 120 ppm, copper plating was provided at a liquid temperature of 40° C., a current density of 18 A / dm2, and a voltage of 6.0 V until the thickness became 80 μm. The time required for a plating treatment was about 20 minutes. There were no rashes and pits on a plating surface, and plating with a uniform thickness was provided over the full length of the gravure cylinder. Furthermore, the copper plating solution automatic control mechanism was operated normally, and the composition of the copper pla...

example 3

[0045]As a gravure cylinder, a cylindrical base with an aluminum core having a circumference of a circle of 940 mm and a full length of 1100 mm was used. The gravure cylinder was placed in a plating bath under the condition that both ends of the gravure cylinder were chucked. Anode chambers were brought close to the gravure cylinder up to an interval of 20 mm with a slide mechanism controlled by a computer, and the plating solution was overflowed, whereby the gravure cylinder was soaked completely. With the rotation speed of the gravure cylinder being set to be 120 ppm, copper plating was provided at a liquid temperature of 40° C., a current density of 18 A / dm2, and a voltage of 7.7 V until the thickness became 80 μm. The time required for a plating treatment was about 20 minutes. There were no rashes and pits on a plating surface, and plating with a uniform thickness was provided over the full length of the gravure cylinder. Furthermore, the copper plating solution automatic contro...

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Abstract

The present invention provides a copper plating method and apparatus for a gravure cylinder in which copper plating with more uniform thickness can be provided over a full length of a gravure cylinder without causing defects such as rashes and pits irrespective of a size of the gravure cylinder, concentration of a copper plating solution can be managed automatically, a consumption amount of an additive is reduced to make it possible to perform a plating treatment within a short period of time, a power supply cost is reduced, and handling is easy with excellent visibility. A gravure cylinder in a hollow cylindrical shape is held at both ends in a longitudinal direction. The gravure cylinder is accommodated in a plating bath filled with a copper plating solution. The gravure cylinder is energized so that the gravure cylinder functions as a cathode while being rotated at a predetermined speed. A pair of anode chambers in a long box shape, in which insoluble anodes are provided upright slidably to both sides of the gravure cylinder in the plating bath and energized so as to function as an anode, are brought close to both side surfaces of the gravure cylinder at a predetermined interval. Copper plating is provided on an outer peripheral surface of the gravure cylinder.

Description

TECHNICAL FIELD[0001]The present invention relates to a copper plating method and apparatus for a gravure cylinder for providing an outer peripheral surface of a hollow cylindrical gravure cylinder (also called a plate-making roll), used for gravure printing, with copper plating as a printing material for forming a printing surface, and more particularly, to a copper plating method and apparatus for a gravure cylinder, in which copper plating is provided using an insoluble anode.BACKGROUND ART[0002]In gravure printing, minute concave portions (cells) are formed on a gravure cylinder in accordance with plate-making information to produce a printing surface, and the cells are filled with ink so that the ink is transferred to an object to be printed. In a general gravure cylinder, a cylindrical iron core or aluminum core is used as a base, a plurality of layers such as an underlying layer and a peeling layer are formed on an outer peripheral surface of the base, and a copper plating la...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C25D5/04C25D17/00
CPCB41N3/032C25D7/04C25D17/06C25D17/12C25D21/06C25D21/10C25D21/18C25D17/002C25D17/008C25D5/04C25D21/14
Inventor INOUE, MANABUMATSUMOTO, NORIKO
Owner THINK LABORATORY CO LTD
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