Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof

Abstract

Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2008-51003, filed May 30, 2008, entitled “COOLING FIN AND PACKAGE SUBSTRATE COMPRISING THE COOLING FIN AND FABRICATING METHOD OF THE SAME”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION [0002]1. Field of the Invention[0003]The present invention relates generally to a cooling fin and a package substrate comprising the cooling fin and a manufacturing method thereof, and, more particularly, to a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof.[0004]2. Description of the Related Art[0005]These days, in response to miniaturization and the widening of the functionality of electronic products, more passive / active devices and semiconductor chips (IC) are mounted in the electronic products and package...

AI Technical Summary

Benefits of technology

[0013]Furthermore, the present invention provides a cooling fin, which may be manufactured a simple process of injecting fireable paste containing carbon nanotubes or carbon nanofiber, and a method of manufacturing the cooling fin.

[0014]Furthermore, the present invention provides a package substrate, which may be manufactured by attaching a cooling fin having an improved cooling performance to the package substrate, and a method of ma

Problems solved by technology

However, as the number of their mounting and packaging are increased, power consumption and heat generation are increased, thus exerting a bad influence on reliability of products and on their attractiveness to customers.

If chemical vapor deposition is used, although it is possible to grow the carbon nanotubes in a vertical direction, it is impossible to enable the carbon nanotubes to have various structures.

Thus, there is a limit to the production of cooling fins whose high cooling performance is due to an increase in the surface area of the cooling fins.

Further, since the chemical vapor deposition process mus

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