METHOD TO CONVERT SILICON POWDER TO HIGH PURITY POLYSILICON THROUGH INTERMEDIATE SiF4

Abstract

A process for the recovery of silicon includes providing silicon-containing solids recovered from a silicon manufacturing process, said recovered silicon-containing solids being substantially free of semiconductor dopants; converting the recovered silicon-containing solids into gaseous silicon forms; subjecting to purification by minimal distillation; collecting the gaseous silicon forms as a condensed liquid of silicon-containing compounds; and utilizing the silicon-containing compounds for silicon deposition.

Description

INCORPORATION BY REFERENCE[0001]All patents, patent applications and publications cited herein are hereby incorporated by reference in their entirety in order to more fully describe the state of the art as known to those skilled therein as of the date of the invention described herein.CROSS-REFERENCE TO RELATED APPLICATIONS[0002]This application claims the benefit of priority under 35 U.S.C. §119(e) to co-pending U.S. Patent Application No. 61 / 137,904 filed on Aug. 4, 2008, entitled “METHOD TO CONVERT KERF SILICON TO HIGH PURITY POLYSILICON,” which is incorporated herein by reference in its entirety.[0003]This application claims the benefit of priority under 35 U.S.C. §119(e) to co-pending U.S. Patent Application No. 61 / 197,714 filed on Oct. 30, 2008, entitled “METHOD TO CONVERT SILICON POWDER TO HIGH PURITY POLYSILICON THROUGH INTERMEDIATE SiF4,” which is incorporated herein by reference in its entirety.[0004]This application claims the benefit of priority under 35 U.S.C. §119(e) t...

AI Technical Summary

Benefits of technology

[0024]Methods are disclosed to recover silicon from silicon-containing solids recovered from a silicon manufacturing process, and produce high purity polysilicon at competitive costs. Methods are disclosed to provide robust, industrially practical and cost-effective methodology to convert recovered silicon into high purity polysilicon.

[0033]reducing the abrasive content from the kerf silicon waste; and

Problems solved by technology

The processes, collectively called the Siemens Process, are very energy intensive.

This MG-Si material is inexpensive but is of very low (98%-99%) purity.

These residual impurities in MG-Si make it unsuitable for direct use as feedstock for the electronic and PV industries.

These distillation purifications of the TCS contribute to more than 50% of the TCS plant operating costs.

These saw processes also produce significant silicon waste, known as kerf silicon waste, due to the cutting of the silicon ingot or block.

Slicing silicon ingot or block to make wafers is one of the most expensive and wasteful process steps in the silicon value chain, especially in the PV cell manufacturing industry.

This adds significantly to the silicon shortage of the PV industry and in addition, to PV cell manufacturing costs.

While the silicon wafer industry, in collaboration with the wire saw manufacturers, has developed practical processes to recover the cutting fluid and bulk of silicon carbide abrasive from the wafer cutting systems, recovering the silicon powder from the slurry has eluded the PV feedstock industry.

Silicon is also lost in ingot shaping operations and due to lapping and other chemical mechanical operations on wafers.

No serious attempts have been made to recover the silicon powder from these waste streams.

It is very doubtful that such methods will produce high purity PV grade silicon at reasonable cost.

This powder is of high purity, but cannot easily be recycled or used in silicon melting and crystal growth applications because of the finity of the powder.

While the polysilicon industry sometimes practices a simple melting process to recover the silicon dust waste, this process is ineffective, costly and inherently lacks purification of the material.

As with the kerf silicon, the challenge is recovering the silicon dust waste and produce silicon of the correct or improved purity and process cost.

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