Copper alloy strip material for electrical/electronic components
a technology of copper alloy and electrical/electronic components, applied in the direction of basic electric elements, solid-state devices, transportation and packaging, etc., can solve the problems of not being able to meet the properties of such as the ability of plating thereon, the wettability of solder, etc., and achieve the effect of superior surface quality
Inactive Publication Date: 2010-09-02
FURUKAWA ELECTRIC CO LTD
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- Description
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Benefits of technology
[0015]That is to say, according to the present invention, it becomes able to obtain a Cu—Ni—Si alloy (a Corson copper), that is superior in surface quality thereof.
Problems solved by technology
Moreover, such the subjects as mentioned above have not been considerable for such as the conventional substance to be made use for the lead frame or the like.
However, in recent years, there becomes to be increased a requirement of such as an environment resistant property under an environment of a higher temperature and of a higher humidity, a correspondence to the lead free soldering, or the like, and then according to any one of the technologies as disclosed in the above mentioned each of the Japanese Patent Application Publications, there becomes to be happened that it is not able to satisfy the property of such as the ability of plating thereon, the solder wettability thereon, or the like.
Method used
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example 1
[0060]First of all, there is performed a dissolution for an alloy, that contains the components as shown in Table 1, and that is comprised of Cu and an unavoidable impurity as the remaining percentage thereof, by making use of a high frequency melting furnace, and then thereafter there becomes to be casted by making use of such the alloy with a rate of cooling therefor as between 10° C. per second and 30° C. per second. Hence, it becomes able to obtain an ingot, which has a thickness as 30 mm, a width as 100 mm and a length as 150 mm.
[0061]And then thereafter, there is performed to be maintained such the ingot, that is obtained thereby, at between 930° C. and 970° C. for between a half hour and one hour. Next, there becomes to be performed a hot rolling therefor to form a hot rolled strip with having a strip thickness of at as 12 mm, and then thereafter there becomes to be performed a facing for both surfaces of such the strip to become the t thereof as 10 mm. Next, there becomes to...
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Abstract
An copper alloy strip material for electrical / electronic components according to the present invention is characterized in that such the copper alloy strip material for electrical / electronic components includes: Ni as between 1.5 mass % and 4.0 mass %; Si as between 0.3 mass % and 1.5 mass %; and the balance being Cu and unavoidable impurities, wherein a mean roughness Ra of a surface roughness is not larger than 0.3 μm regarding the strip in a direction as right angle to a direction of a rolling therefor, a maximum height Ry thereof is not higher than 3.0 μm regarding the same therein, and there is positioned a peak position regarding a frequency curve, that represents a concave component of the surface roughness and / or a convex component thereof, at the plus side (the side for the convex component) comparing to an average value of the curve for meaning the surface roughness.
Description
TECHNICAL FIELD[0001]The present invention relates to a copper alloy strip material.BACKGROUND ART[0002]So far, as a material for an electrical machinery and apparatus and for electronic equipment in general, there is widely made use of a copper-based material, as that is superior in electrical conduction property and in thermal conductivity, such as phosphor bronze, tombac, brass, or the like, in addition to a iron-based material.[0003]In recent years, there becomes to be further required for packaging as a smaller in size of the electrical machinery and apparatus and of the electronic equipment, for lighter in weight thereof, and for packaging as higher density according thereto. And then thereby there becomes to be required a variety of properties for such the copper-based material to be applied thereto. Here, it is able to be provided as a principal property therefor, such as a strength thereof, an electrical conductivity thereof, a withstand stress and relaxation characteristic...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C22C9/06
CPCC22C9/06C22F1/08H01L23/13H01L23/14Y10T428/12993H01L2924/0002H01L23/49579H01L2924/00H01L23/48
Inventor MIHARA, KUNITERUNAKANO, JUNSUKESUGAHARA, CHIKAHITOUNO, TAKEO
Owner FURUKAWA ELECTRIC CO LTD