Footing Reduction Using Etch-Selective Layer

Abstract

A method of forming side spacers upwardly extending from a substrate, includes: providing a template constituted by a photoresist formed on and in contact with an etch-selective layer laminated on a substrate; anisotropically etching the template in a thickness direction with an oxygen-containing plasma to remove a footing of the photoresist and an exposed portion of the underlying layer; depositing a spacer film on the template by atomic layer deposition (ALD); and forming side spacers using the spacer film by etching. The etch-selective layer has a substantially lower etch rate than that of the photoresist.

Description

BACKGROUND[0001]1. Field of the Invention[0002]The present invention relates to semiconductor integrated circuit manufacturing and, more particularly to a method of forming side spacers, particularly on space-defined double patterning (SDDP).[0003]2. Description of the Related Art[0004]Photolithography technology has recently faced difficulty of forming patterns having pitches smaller than the submicron level. Various approaches have been studied, and one of the promising methods is space-defined double patterning (SDDP) which makes it possible to create narrow pitches beyond limitations of conventional lithography such as light source wavelength and high index immersion fluid. Generally, SDDP needs one conformal spacer film and hardmask template wherein the conformal spacer film is deposited on the template normally having convex patterns. A silicon oxide layer is commonly used as a conformal spacer, and a hardmask template is typically constituted by photoresist (PR) prepared by a...

AI Technical Summary

Benefits of technology

[0009]In some embodiments of the present invention, by conducting plasma irradiation prior to formation of a spacer layer to anisotropically etch a template constituted by a photoresist formed on and in contact with an etch-selective layer laminated on a substrate, said etch-selective layer has a substantially lower etch rate than that of the photoresist, thereby reducing a widened footing of the photoresist.

Problems solved by technology

Photolithography technology has recently faced difficulty of forming patterns having pitches smaller than the submicron level.

As a result, the thickness of the side spacer at the bottom appears to be widened (F), which is significantly greater than the thickness of the side spacer itself, thereby causing unexpected critical dimension (CD) changes or the like.

However, it is still difficult to control the transferred footing shape.

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