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Uv-curable adhesive silicone composition, uv-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same

a technology of adhesive silicone and composition, which is applied in the direction of photomechanical apparatus, semiconductor/solid-state device details, instruments, etc., can solve the problems of affecting the processing efficiency of the composition, the deformation of the shape, and the inability to obtain the target shape of the cured material, etc., to achieve the effect of convenient handling

Inactive Publication Date: 2013-07-18
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is a UV-curable adhesive silicone composition that can be cured without flowing during heat-curing, and can easily form a resin cured layer by curing only a necessary portion with a UV light source and a mask. The composition is in a solid state or semi-solid state at room temperature, is easy to handle, and can be readily adhered to semiconductor devices such as LED chips. The composition can contain a phosphor and uniformly disperse it in the resulting resin cured layer. The resulting cured material has excellent color rendering properties, flexibility, and low surface tackiness. The technical effects of the invention provide a stable and efficient method for forming a mounted and phosphor-containing resin cured layer with good color rendering properties.

Problems solved by technology

However, as a result thereof, a curing speed of the composition becomes slow and the composition flows during heat-curing to cause a problem of deformation of a shape thereof.
However, according to a method of the Patent Literature 4, since a property before curing has fluidity, there is a problem that a resin composition flows before the organosiloxane composition is completely cured, and a cured material having a target shape can not be obtained.
However, when the phosphor is irregularly dispersed or unevenly concentrated, color deviation tends to occur.
However, there was a problem that a manufacturing step is made complicated and the degree of obtained stability is insufficient.

Method used

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  • Uv-curable adhesive silicone composition, uv-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same
  • Uv-curable adhesive silicone composition, uv-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same
  • Uv-curable adhesive silicone composition, uv-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same

Examples

Experimental program
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Effect test

synthesis example 1

—Vinyl Group-Containing Organopolysiloxane Resin (A1)—

[0124]After dissolving 27 mol of organosilane represented as PhSiCl3, 1 mol of ClMe2SiO(Me2SiO)33SiMe2Cl and 6 mol of Me2ViSiCl in a toluene solvent, a toluene solution was dropped in water and cohydrolyzed, further after cleaning with water, and neutralizing and dewatering by alkali cleaning, by stripping the solvent, a vinyl group-containing resin (A1) was synthesized.

[0125]In the resin, a constituent ratio of siloxane units which constitute the resin and a structure represented by [-SiMe2O-(Me2SiO)33—SiMe2O2 / 2] is denoted by a formula: [PhSiO3 / 2]0.27[—SiMe2O-(Me2SiO)33—SiMe2O2 / 2]0.01[Me2ViSiO1 / 2]0.06. The weight average molecular weight of the resin was 65,000, and the melting point thereof was 58° C.

synthesis example 2

—Hydrosilyl Group-Containing Organopolysiloxane Resin (B1)—

[0126]After dissolving 27 mol of organosilane represented as PhSiCl3, 1 mol of ClMe2SiO(Me2SiO)33SiMe2Cl, and 6 mol of Me2HSiCl in a toluene solvent, a toluene solution was dropped in water and cohydrolyzed, further after cleaning with water, and neutralizing and dewatering by alkali cleaning, by stripping the solvent, a hydrosilyl group-containing resin (B1) was synthesized.

[0127]In the resin, a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe2O-(Me2SiO)33—SiMe2O2 / 2] is denoted by a formula: [PhSiO3 / 2]0.27[—SiMe2O-(Me2SiO)33—SiMe2O2 / 2]0.01[Me2HSiO1 / 2]0.06. The weight average molecular weight of the resin was 56,000, and the melting point thereof was 56° C.

synthesis example 3

—Vinyl Group-Containing Organopolysiloxane Resin (A2)—

[0128]After dissolving 27 mol of organosilane represented as PhSiCl3, 1 mol of ClMe2SiO(Me2SiO)33SiMe2Cl, and 9 mol of Me2ViSiCl in a toluene solvent, a toluene solution was dropped in water and cohydrolyzed, further after cleaning with water, and neutralizing and dewatering by alkali cleaning, by stripping the solvent, a vinyl group-containing resin (A2) was synthesized.

[0129]In the resin, a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe2O-(Me2SiO)33—SiMe2O2 / 2] is denoted by a formula: [PhSiO3 / 2]0.27[—SiMe2O-(Me2SiO)33—SiMe2O2 / 2]0.01[Me2ViSiO1 / 2]0.09. The weight average molecular weight of the resin was 62,000, and the melting point thereof was 61° C.

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Abstract

A UV-curable adhesive silicone composition includes: (A) an organopolysiloxane having a resin structure consisting of R1SiO3 / 2, R22SiO2 / 2, and R3aR4bSiO(4-a-b) / 2 units, wherein R4 represents a vinyl group or an allyl group, wherein 5 to 300 R22SiO2 / 2 units are continuously repeated, (B) an organohydrogenpolysiloxane having a resin structure consisting of R1SiO3 / 2, R22SiO2 / 2, and R3cHdSiO(4-c-d) / 2 units, wherein 5 to 300 R22SiO2 / 2 units are continuously repeated, and (C) a photoactive catalyst, wherein the UV-curable adhesive silicone composition is in a plastic solid state or a semi-solid state in an uncured state at room temperature. Thereby, there can be provided a UV-curable adhesive silicone composition that is in a plastic solid state or a semi-solid state in an uncured state at room temperature and therefore easy to handle, can uniformly disperse a phosphor and cover a surface of an LED chip, and can readily form a cured layer only on a necessary portion.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a UV-curable adhesive silicone composition, a UV-curable adhesive silicone composition sheet, an optical semiconductor apparatus, and a method for manufacturing the same.[0003]2. Description of the Related Art[0004]At the present time, since a silicone resin is excellent in the light resistance, it gathers an attention as a material for covering for sealing and protecting a light-emitting diode (LED) device (see Patent Literature 1). Further, in a field of light-emitting diodes, it is well known to use a phosphor as a wavelength converter (see Patent Literature 2). As a film in which a phosphor is dispersed, a thermosetting silicone resin is put into practical use (see Patent Literature 3). However, since a hydrosilylation reaction is used to cure, in many cases, a platinum-based catalyst is added in advance in a thermosetting silicone resin composition. As a result, from immediately aft...

Claims

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Application Information

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IPC IPC(8): C09J183/04H01L33/56
CPCC08G77/12C08G77/20H01L2224/45144H01L2224/73265H01L2224/48091C08L83/04G03F7/0757H01L23/296C08G77/70C08G77/80C08L2205/02C09J183/04H01L33/56H01L2924/00014H01L2924/00C09J7/00C09J2203/326H01L21/02G03F7/0751G03F7/0758G03F7/40
Inventor KASHIWAGI, TSUTOMUSHIOBARA, TOSHIO
Owner SHIN ETSU CHEM IND CO LTD