Flexible heat transfer assembly

Abstract

A flexible heat transfer assembly includes a covering layer (100) and a functional filler (200). The covering layer (100) surroundingly forms a sealed chamber (11), in which the material of the covering layer (100) is one of rubber, silica rubber, and resin. The functional filler (200) is filled in the sealed chamber (110). The functional filler (200) comprises at least one of silicone, silicone oil, silica gel, and paraffin, and at least one of ceramic powder, metal powder, metal oxide powder, and graphene. By means of the covering layer (100) tightly attached to a heat-generating part and by means of the heat transfer of the functional filler (200), the flexible heat transfer assembly can absorb or dissipate the heat generated by the heat-generating part.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat-absorbing device, and in particular, to a flexible heat transfer assembly.[0003]2. Description of Related Art[0004]The integrated circuits disposed in a general mobile electronic device (for example, a notebook computer and a smart phone) comprise active elements such as transistors. Heat is generated by theses active elements when they perform operations. As the performance requirement of the mobile electronic devices increases, more transistors have to be disposed in the integrated circuits, resulting in more and more heat generated. However, the surface of the chip is not increased accordingly and thus the heating density of the electronic device increases, causing the over-temperature problem of the heat-generating part. According to the 10° C. theory (i.e., the Arrhenius Law), a rise in temperature of the heat-generating part by 10° C. will halve the effective lifetime thereo...

AI Technical Summary

Benefits of technology

[0019]The flexible heat transfer assembly of the present invention can reduce the surface temperature of the heat-generating part and maintain its operational performance by means of the covering layer tightly attached to the heat-generating part and by means of the functional filler, in the coveri

Problems solved by technology

However, the surface of the chip is not increased accordingly and thus the heating density of the electronic device increases, causing the over-temperature problem of the heat-generating part.

Over-temperature not only damages semiconductor devices, but also degrades the reliability and operating performance thereof.

Thus, the heat dissipation issue of electronic products causes a technical bottleneck of related products and becomes necessary to be considered.

Since the heat-generating part (e.g., CPU) and metal heat dissipator

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