Methods of forming structures for downhole applications, and related downhole structures and assemblies

Abstract

A method of forming a structure for a downhole application comprises forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate. A downhole structure and a downhole assembly are also described.

Description

FIELD[0001]Embodiments of the disclosure relate generally to methods of forming structures for downhole applications, and to related downhole structures and assemblies. More particularly, embodiments of the disclosure relate to methods of forming downhole structures including at least one substrate adhered to at least one other substrate by way of an interfacial material, and to related downhole structures and assemblies.BACKGROUND[0002]Wellbores are formed in subterranean formations for various purposes including, for example, extraction of oil and gas from the subterranean formations and extraction of geothermal heat from the subterranean formations. Wellbores can exhibit extremely aggressive environments. For example, wellbores are can exhibit abrasive surfaces, can be filled with corrosive chemicals (e.g., caustic drilling muds, well fluids, such as salt water and crude oil, as well as entrained carbon dioxide, hydrogen sulfide, etc.), and can exhibit increasing high temperature...

AI Technical Summary

Benefits of technology

This patent describes a method and structures for creating a durable material for use in downhole applications. The method involves using an interfacial material made of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, or polyphenylsulfone to bond two substrates together. The resulting structure is a strong and reliable material that can withstand the harsh environment of a downhole application.

Problems solved by technology

Wellbores can exhibit extremely aggressive environments.

The extremely aggressive environments of wellbores can rapidly degrade the interfacial materials of structures, tools, and assemblies used in various downhole applications (e.g., drilling applications, conditioning applications, logging applications, measurement applications, monitoring applications, exploring applications, etc.).

Such degradation limits operational efficiency, and results in undesirable repair and replacement costs.

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