Methods of forming structures for downhole applications, and related downhole structures and assemblies

Abstract

A method of forming a structure for a downhole application comprises forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate. A downhole structure and a downhole assembly are also described.

Description

FIELD[0001]Embodiments of the disclosure relate generally to methods of forming structures for downhole applications, and to related downhole structures and assemblies. More particularly, embodiments of the disclosure relate to methods of forming downhole structures including at least one substrate adhered to at least one other substrate by way of an interfacial material, and to related downhole structures and assemblies.BACKGROUND[0002]Wellbores are formed in subterranean formations for various purposes including, for example, extraction of oil and gas from the subterranean formations and extraction of geothermal heat from the subterranean formations. Wellbores can exhibit extremely aggressive environments. For example, wellbores are can exhibit abrasive surfaces, can be filled with corrosive chemicals (e.g., caustic drilling muds, well fluids, such as salt water and crude oil, as well as entrained carbon dioxide, hydrogen sulfide, etc.), and can exhibit increasing high temperature...

AI Technical Summary

Benefits of technology

[0010]Methods of forming structures for use in downhole applications are described, as are downhole structures and downhole assemblies. In some embodiments a method of forming a structure for a downhole application comprises forming interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between a first substrate and a second substrate. The interfacial material and downhole structures, tools, and assemblies including the interfacial material may exhibit enhanced properties (e.g., enhanced mechanical strength, adhesion strength, wear resistance, thermal resistance, chemical resistance, etc.) favorable to the use of the interfacial material and the downhole structures, tools, and assemblies incorporating the interfacial material in downhole applications. The methods, materials, and structures of the disclosure may increase the efficiency of downhole operations and reduce costs as compared to corresponding conventional methods, materials, and structures.

Problems solved by technology

Wellbores can exhibit extremely aggressive environments.

The extremely aggressive environments of wellbores can rapidly degrade the interfacial materials of structures, tools, and assemblies used in various downhole applications (e.g., drilling applications, conditioning applications, logging applications, measurement applications, monitoring applications, exploring applications, etc.).

Such degradation limits operational efficiency, and results in undesirable repair and replacement costs.

Images