99 results about "Polyphenylsulfone" patented technology

An optical encoder whose environmental resistance is improved by increasing the variety of options of materials for a resin-made code plate thereof. Used as material for at least a code pattern of the code plate of the optical encoder is one which meets the condition that the material has spectral transmittance of 70% or more with respect to detection light and that of 50% or less with respect to partial light (for example blue light) of visible wavelengths in translucent sections. If infrared light having wavelengths between 800 nm and 1000 nm is used as detection light, it is preferable to apply polyetherimide, polyethersulfone or polyphenylsulfone as a colored resin material. These materials are excellent in heat resistance, oil resistance, etc., compared to transparent and colorless materials (PMMA, PC, glass, etc.) which have been conventionally used, and hardly cause melting, deformation, white turbidity, etc., in a harsh environment.

A three-dimensional object created by Fused Deposition Modeling (FDM) of a modeling material from polyaryletherketones (PAEK), polyphenylsulfides, polyamide-imide, polyethersulfon, polyetherimide, polysulfon, polyphenylsulfon, polycarbonates (PC), polyacrylonitrile butadiene styrene) (ABS), polymethylmethacrylate (PMMA), polyethyleneterephtalate (PET), polystryrene (PS), acrylonitrilstyrene acrylate, polypropylene (PP), polylactic acid (PLA), polyvinylalcohol (PVA), polyethylene (PE), polyoxymethylene, polyurethane (PU), copolymers of polyvinylalcohol and butenediolvinylalcohol and mixtures thereof, optionally filled with inorganic or organic fillers, wherein the object has a porosity of less than 5 vol %, as determined according to the porosity test procedure ‘Porosity test’. The objects are leak tight and show improved mechanical properties. FDM printing of PEEK generating parts having high isotropy.

Blends of a polyphenylene sulfone (PPSU); a polyphenylene sulfide (PPS); and, a polyetherimide and epoxy. The polyetherimide and epoxy are present in an amount effective to act as a compatibilizer for the polyphenylene sulfone (PPSU) and polyphenylene sulfide (PPS). Methods of compatibilizing a blend of polyphenylene sulfone (PPSU) and polyphenylene sulfide (PPS). The method can include melt mixing a polyphenylene sulfone (PPSU) and a polyetherimide; and melt mixing a polyphenylene sulfide (PPS) and an epoxy.

A foam material having one glass transition temperature (Tg) and made from an immiscible composition having at least two glass transition temperatures (Tg) by an extrusion process wherein said composition (C) comprises at least one polyarylene (P1) polymer, wherein more than 50 % by moles (moles %) of the recurring units of said (P1) polymer are recurring units (R1) consisting of an arylene group, wherein said arylene group is a hydrocarbon divalent group consisting of one core composed of one benzene ring or of a plurality of benzene rings fused together by sharing two or more neighboring ring carbon atoms, said benzene ring being optionally substituted, wherein each of said arylene group is bound to two other arylene groups of neighboring recurring units (R1) through a first C-C bond (E1) and a second C-C bond (E2), wherein at least 20 moles % of recurring units (R1) are kink- forming arylene units (R1-b), the remainder being rigid rod- forming arylene units (R1-a) different from aryleneR1_b units, wherein in said aryleneR1_a units the bond (E1) and the bond (E2) are co-linear and anti- parallel towards each other, said (P1) polymer being present in composition (C) in an amount of below 75 % by weight (wt. %) and above 10 wt. % based on the total wt. % of (P1) polymer and (PPSU) polymer, and (ii) at least one polyphenylsulfone polymer, said (PPSU) polymer being present in composition (C) in an amount of below 90 wt. % and above 25 wt. % of based on the total wt. % of polyarylene (P4) polymer and (PPSU) polymer.