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Optical device for a lithography apparatus, and lithography apparatus

a technology of optical devices and lithography equipment, applied in the direction of microlithography exposure equipment, mountings, instruments, etc., can solve the problems of limiting the relative movement of the supporting frame and the sensor frame with respect to one another, and achieve the effect of reliably preventing damage or deformation of the mating contact elemen

Active Publication Date: 2019-01-03
CARL ZEISS SMT GMBH
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  • Application Information

AI Technical Summary

Benefits of technology

The patent describes an optical device that uses a sensor arrangement to determine the width of a gap in a non-contact manner. The device includes a contact element and a contact surface that function as an end stop, saving structural space and component parts. The contact element can be made from an aluminum-bronze alloy to achieve high compressive strength and low abrasion. The contact surface can be provided on either the supporting frame or the sensor frame. The device also includes a guard ring capacitor for field shielding to increase measurement accuracy. The width of the gap can be determined with an accuracy of 10 μm. The technical effects of the patent are a more compact and integrated optical device with improved accuracy and reliability.

Problems solved by technology

Secondly, they limit the relative movement of the supporting frame and sensor frame with respect to one another, that is to say that the contact element functions as an end stop.

Method used

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  • Optical device for a lithography apparatus, and lithography apparatus
  • Optical device for a lithography apparatus, and lithography apparatus
  • Optical device for a lithography apparatus, and lithography apparatus

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Embodiment Construction

[0046]In the figures, identical or functionally identical elements have been provided with the same reference signs, unless indicated to the contrary. Insofar as a reference sign has a plurality of reference lines in the present case, this means that the corresponding element is present multiply. Reference sign lines pointing to concealed details are illustrated in a dashed manner. It should also be noted that the illustrations in the figures are not necessarily true to scale.

[0047]FIG. 1A shows a schematic view of an EUV lithography apparatus 100A, which includes a beam shaping and illumination system 102 and a projection system 104. EUV stands for “extreme ultraviolet” and refers to a wavelength of the working light of between 0.1 and 30 nm. The beam shaping and illumination system 102 and the projection system 104 are respectively provided in a vacuum housing (not shown), each vacuum housing being evacuated with the aid of an evacuation device (not shown). The vacuum housings are...

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Abstract

The disclosure relates to an optical device for a lithography system, including an optical element, a supporting frame supporting the optical element, a sensor frame mechanically decoupled from the supporting frame, wherein a gap is provided between the supporting frame and the sensor frame, and a sensor assembly designed to determine a width of the gap in a contactless manner. The sensor assembly has a contact element and a contact surface. The contact element is designed to contact the contact surface to limit relative motion of the supporting frame relative to the sensor frame.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application is a continuation of, and claims benefit under 35 USC 120 to, international application PCT / EP2017 / 053289, filed Feb. 14, 2017, which claims benefit under 35 USC 119 of German Application No. 10 2016 204 143.6, filed Mar. 14, 2016. The entire disclosure of these applications are incorporated by reference herein.FIELD[0002]The disclosure relates to an optical device for a lithography apparatus, and to a lithography apparatus including such an optical device.BACKGROUND[0003]Microlithography is used for producing microstructured components, for example integrated circuits. The microlithographic process is performed using a lithography apparatus, which has an illumination system and a projection system. The image of a mask (reticle) illuminated via the illumination system is in this case projected via the projection system onto a substrate (for example a silicon wafer) which is coated with a light-sensitive layer (phot...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/70033G03F7/702G03F7/70833G03F7/70758G03F7/70166G03F7/70825G02B7/1828G03F7/7015
Inventor ZWEERING, RALF
Owner CARL ZEISS SMT GMBH