Multifunctional thermal management system and related method

Abstract

A system and related method that provides, but is not limited thereto, a thin structure with unique combination of thermal management and stress supporting properties. An advantage associated with the system and method includes, but is not limited thereto, the concept providing a multifunctional design that it is able to spread, store, and dissipate intense thermal fluxes while also being able to carry very high structural loads. An aspect associated with an approach may include, but is not limited thereto, a large area system for isothermalizing a localized heating source that has many applications. For example it can be used to mitigate the thermal buckling of ship deck plates, landing pad structures, or any other structures subjected to localized heating and compressive forces. It can also be used as a thermal regulation system in numerous applications, including but not limited to under-floor heating for residential or commercial buildings or for the de-icing of roads, runways, tunnels, sidewalks, and bridge surfaces.

Description

RELATED APPLICATIONS[0001]The present application claims priority from U.S. Provisional Application Ser. No. 61 / 295,112, filed Jan. 14, 2010, entitled “A Multifunctional Heat Pipe Solution to Plate Thermal Buckling and Related Method,” the disclosure of which is hereby incorporated by reference herein in its entirety.FIELD OF THE INVENTION[0002]The present invention relates generally to the field of thermal management. More specifically, the present invention also relates to thermal conduction, heat capacity, heat pipe systems, and phase change materials.BACKGROUND OF THE INVENTION[0003]Amphibious Assault Ships support US Marine Corps expeditionary forces for extended periods of time. They in some ways resemble small aircraft carriers and are capable of supporting both Marine air and rotorcraft and a variety of amphibious vehicles. The landing helicopter deck (LHD) class of multipurpose amphibious assault ship was designed to facilitate the use of the AV-8B Harrier, Landing Craft Ai...

AI Technical Summary

Benefits of technology

[0010]An aspect of an embodiment of the present invention provides for, but is not limited thereto, the design of thin (in some instances less than about one inch thick, for example) thermal management systems (TMS). The solutions may utilize various high thermal conductivity materials, heat pipes, and heat plate concepts to facilitate the storage, transport and eventual dissipation of the thermal energy using designs that are able to withstand very high localized compressive loads. The heat plate concepts can be combined with thermal insulation layers and coated with spray-deposited nonskid coatings capable of providing high-coefficient-of-friction surfaces. These systems could be used to protect surfaces that are subject to high localized thermal and compressive forces, such as landing pads and ship decks, or to facilitate improved thermal regulation systems in applications such as under-floor heating and road de-icing.

[0012]An aspect of an embodiment of the present invention provides an anisotropic thermal management system. The system may comprise: a high thermal conductivity layer to increase in-plane heat spreading across the high thermal conductivity layer; a low thermal conductivity layer to reduce heat transfer in the direction orthogonal to the low thermal conductivity layer; and wherein the system protects a load-bearing surface, structure, or component that is proximal to the low thermal conductivity layer, and distal from the high thermal conductivity layer, from excessive heat applied to the high thermal conductivity layer.

[0013]An aspect of an embodiment of the present invention provides an anisotropic thermal management system. The system may comprise: a high thermal conductivity layer to increase in-plane heat spreading across the high thermal conductivity layer; a low thermal conductivity layer to reduce heat transfer in the direction orthogonal to the low thermal conductivity layer and distal from the high thermal conductivity layer; and a localized heating element, cooling element, or both in communication with the high thermal conductivity layer. The system facilitates temperature regulation of the region proximal to the high thermal conductivity layer and distal to the low thermal conductivity layer; and wherein at least a portion of the system a) acts as a load-bearing surface, structure, or component and / or b) is in communication with a load-bearing surface, structure, or component that is proximal to the low thermal conductivity layer, and distal from the high thermal conductivity layer.

[0014]An aspect of an embodiment of the present invention provides a thermal management method for protecting a load-bearing surface, structure, or component. The method may comprise: providing a high thermal conductivity layer to increase in-plane heat spreading across the high thermal conductivity layer; and providing a low thermal conductivity layer to reduce heat transfer in the direction orthogonal to the low thermal conductivity layer. The method protects the load-bearing surface, structure, or component that is proximal to the low thermal conductivity layer, and distal from the high thermal conductivity layer, from excessive heat applied to the high thermal conductivity layer.

[0015]An aspect of an embodiment of the present invention provides a method for facilitating temperature regulation of a region proximal to a high thermal conductivity layer and distal to a low thermal conductivity layer. The method may comprise: providing the high thermal conductivity layer to increase in-plane heat spreading across the high thermal conductivity layer; providing the low thermal conductivity layer to reduce heat transfer in the direction orthogonal to the low thermal conductivity layer and distal from the high thermal conductivity layer; and providing a localized heating element, cooling element, or both in communication with the high thermal conductivity layer. A portion of the high thermal conductivity layer and / or low thermal conductivity layer: a) acts as a load-bearing surface, structure, or component and / or b) is in communication with a load-bearing surface, structure, or component that is proximal to the low thermal conductivity layer, and distal from the high thermal conductivity layer.

Problems solved by technology

However, the introduction of the MV-22 has to these amphibious assault ships has resulted in flight deck warping during flight operations.

During MV-22 ship integration tests aboard the USS Iwo Jima (LHD 7) in June 2004, there were reports of excessive heating and large deflections of the flight deck in the vicinity of the aircraft's right nacelle.

Subsequent Navy assessments of the thermal loads imposed by the landing of the F-35B Joint Strike Fighter on these ships indicated unacceptably severe heating of the deck and its (organic base) nonskid coating during landing.

This buckling stress results in significant forces applied to the welds between the deck plate and the support structure.

(See Edward L. Davis, Young C. Hwang and David P. Kihl, “Structural Evaluation of an LHD-Class Amphibious Ship Flight Deck Subjected to Exhaust Gas Heat from a MV-22 Osprey Aircraft “NSWCCD-65-TR-2006 / 12 March 2006) indicate that the forces are sufficient to cause local plastic deformation which is likely to result in fatigue failure of the deck before the ship reaches its design life.

Impingement of the high temperature MV-22 and F-35B engine plumes upon this coating is likely to result in its rapid degradation during flight operations and so a new high temperature nonskid coating is required.

However, these coatings are susceptible to delamination during severe thermal cyclic loading and have low strengths.

Heretofore the prior art has failed to be able to adequately dissipate or protect the ship decks from the exhaust of high temperature plumes of jet craft.

Moreover, regarding buildings, structures and housings, the prior art has failed to be able to efficiently minimize or contain the additional energy expenditure necessary to transfer heat or cooling to intended areas of the buildings, structures, housings or areas.

Existing heating and cooling systems for buildings, structures, and housing are also structurally parasitic, since they require architectural accommodation to provide the necessary space and support.

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