Method for patterning a material layer with desired dimensions

Abstract

Methods for patterning a film stack are provided. In one embodiment, a method for patterning a film stack disposed on a substrate includes performing a first etching process to etch a film stack disposed on a substrate, wherein the film stack includes a patterned photoresist layer disposed on an upper layer on a lower layer disposed on the substrate, wherein the patterned photoresist layer comprises openings defined between features and the features have a first pitch, wherein the first etching process removes between about 40 percent and about 95 percent of the lower layer exposed by the patterned photoresist layer from the film stack, performing a second etching process on the film stack, and upon completion of the second etching process, transferring the features into the upper or lower layer in the film stack having a second pitch, wherein the second pitch is shorter than the first pitch.

Description

BACKGROUNDField[0001]Examples of the present disclosure generally relate to patterning features and / or openings in a material layer. Particularly, embodiments of the present disclosure provide methods for patterning features and / or openings in a material layer with precision dimension control.Description of the Related Art[0002]In the manufacture of integrated circuits (IC), or chips, patterns representing different layers of the chip are created by a chip designer. A series of reusable masks, or photomasks, are created from these patterns in order to transfer the design of each chip layer onto a semiconductor substrate during the manufacturing process. Mask pattern generation systems use precision lasers or electron beams to image the design of each layer of the chip onto a respective mask. The masks are then used much like photographic negatives to transfer the circuit patterns for each layer onto a semiconductor substrate. These layers are built up using a sequence of processes a...

AI Technical Summary

Benefits of technology

This approach enhances etching selectivity and dimension control, enabling precise feature transfer and reducing deformation in high and low feature density regions, thereby improving the accuracy and reliability of patterned features in integrated circuits.

Problems solved by technology

Thus, any defects in the mask may be transferred to the chip, potentially adversely affecting performance.

Defects that are severe enough may render the mask completely useless.

Thus, due to different etch rates in high and low feature density regions, it is often observed that while the low feature density regions have been etched and defined in a certain desired and controlled vertical dimension, the high feature density regions are bowed and / or undercut by the lateral attacking due to the insufficient sidewall passivation or insufficient etching selectivity of the adjacent layers disposed in the film stack to sustain the film stack until completion of the etching process.

Insufficient selectivity or protection among the material layers disposed in the film stack in high and low feature density regions often results in inability to hold critical dimension of the etch features and poor patterned transfer.

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