Methods and apparatus of processing transparent substrates
Active Publication Date: 2021-09-02
APPLIED MATERIALS INC
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- Description
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- Application Information
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Benefits of technology
This patent text is about the need for better tools to use transparent materials in lithography processes. Using transparent materials can make the process more efficient, increase the number of chips that can be made per substrate, reduce defects, increase productivity, reduce downtime and lower costs.
Problems solved by technology
Operational issues can arise when attempts are made to process transparent substrates using lithography methods.
For example, the transparency of the substrates can make it difficult for lithography machines to recognize that a substrate is in position for processing.
As another example, the transparency of the substrates can make it difficult to align the substrate under a lithography machine.
Difficulty in recognizing the substrates and difficulty in aligning the substrates results in inefficiencies, lower die-per-substrate due to dies being out of alignment during patterning, increased substrate defects, lower throughput for the machine, increased machine downtime, and increased operational costs.
Method used
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Embodiment Construction
[0020]Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one example, the glass substrates are processed prior to undergoing lithography processing.
[0021]FIG. 1A is a partial schematic view of a lithography system 100, according to one implementation. FIG. 1B is a partial schematic plan view of a substrate 106 exposed to a lithography process, according to one implementation. It is to be understood that the lithography system 100 is an exemplary system and other systems may be used with or modified to accomplish aspects of the present disclosure. The lithography system 100 includes a projection unit 102 that includes one or more light sources, such as a light emitting diodes (LEDs) or lasers, capable of projecting write beams 111 to pattern the substrate 106 having one or more layers 121-123 (three are shown) formed on a first surface 103 of the substrate 106. The write beams 111 are projecte...
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Abstract
Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.
Description
BACKGROUNDField[0001]Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one example, the glass substrates are processed prior to undergoing lithography processing.Description of the Related Art[0002]Operational issues can arise when attempts are made to process transparent substrates using lithography methods. For example, the transparency of the substrates can make it difficult for lithography machines to recognize that a substrate is in position for processing. As another example, the transparency of the substrates can make it difficult to align the substrate under a lithography machine. Difficulty in recognizing the substrates and difficulty in aligning the substrates results in inefficiencies, lower die-per-substrate due to dies being out of alignment during patterning, increased substrate defects, lower throughput for the machine, increased machine downtime, and increased operational cos...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C03C17/36C03C17/38
CPCC03C17/3639C03C17/38C03C17/3655C03C17/3626C03C17/3636C03C2218/33C03C17/3411C03C17/3417C03C17/3435C03C17/23C03C2218/365C03C17/3665G03F7/0005C03C2217/213
InventorXU, YONGANCHEN, CHIEN-ANGODET, LUDOVIC
OwnerAPPLIED MATERIALS INC