High density interconnect module

Abstract

A cost-effective packaging system (10) for ultra high density input / output (integrated circuits (14). The packaging system includes a first circuit chip (14) that has a first pattern of contacts (16) distributed across a surface area of the chip (14). The first pattern of contacts (16) represents input / output connections (16). A three-dimensional circuit (18) is disposed spatially parallel with respect to the first circuit chip (14) and organizes the input / output connections (16) into a second pattern of contacts (24, 30) suitable for connection to a second circuit (22). In a specific embodiment, the three-dimensional circuit (18) is a double sided DECAL (18). The double-sided DECAL (18) includes a substrate (18) having a first circuit pattern (28) spatially parallel with a second circuit pattern (30) on or in the substrate (18). The first and second circuit patterns (28 and 30) are interconnected. The first circuit pattern (28) has a third pattern of contacts (16) coincident with the first pattern of contacts (16) on the first circuit chip (14). The first circuit pattern (28) and / or the second circuit pattern (30) are ball grid arrays or coaxial connector arrays. The second circuit (22) is disposed spatially parallel with respect to the three-dimensional circuit (18). The second circuit (22) is a ceramic or laminate interposer that facilitates further organization of the input / output connections (16, 24). The interposer (18) includes a ball grid array (24) or a coaxial connector grid array (18) to facilitate the organization. A z-axis adhesive (20) is disposed between the interposer (22) and the three-dimensional circuit (18). A non-hermetic sealer (12) disposed over the first circuit chip (14).

Description

1. Field of InventionThis invention relates to electronic packaging. Specifically, the present invention relates to systems and methods for packaging microprocessors with highdensity input / output connections in space limited applications.2. Description of the Related ArtIntegrated circuits having hundreds or thousands of input / output connections are used in a variety of demanding applications ranging from computer chips to telecommunications digital signal processors. Such applications typically require cost-effective and reliable integrated circuit packaging systems that can effectively accommodate large numbers of interconnections between integrated circuits or circuit boards. Efficient electronic packaging systems and methods for packaging integrated circuit chips are becoming increasingly important as integrated circuits become smaller and more complex.A typical integrated circuit requires multiple input / output lines including power, ground, and signal lines. The lines are often...

AI Technical Summary

Problems solved by technology

However, space is limited along the one-dimensional edges of integrated circuit chips.

The requirement for peripheral connections places design constraints on the integrated circuits, which may increase the cost of the circuits.

In addition, in systems requiring multiple interconnected integrated circuit chips, the use of peripheral connections often dramatically increases the space required to accommodate the multiple chips, thereby increasing the size of the system.

This is particularly problematic in applications such as cellular telephones and calculators where small circuit sizes are of paramount importance.

For example, the BGA substrates often have low thermal conductivity.

The low thermal conductivity decreases connection reliability due to differences in coefficients of thermal expansion between materials used for the balls and the integrated circuit contacts.

The packaging systems often lack adaptability features that allow removal of integrated circuits and replacement with new integrated circuits with different contact patterns.

As a result, the entire package is often discarded.

In addition, due to design limitations inherent in a conventional BGA system, the packaging systems often have unnecessarily large footprints to minimize cross-talk between connections and accommodate high frequency operation.

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