Microphone preamplifier circuit

Abstract

A microphone preamplifier circuit is adapted to be connected to a microphone circuit, the microphone circuit including a microphone and at least one output node. The microphone preamplifier circuit includes a preamplifier including: an operational amplifier having at least one input and at least one output; at least one input DC decoupling capacitor connected to the at least one input of the operational amplifier; at least one feedback capacitor connected between the input and the output of the operational amplifier in order to set together with the at least one input DC decoupling capacitor a gain value of the preamplifier circuit; and first and second feed nodes adapted to be fed by first and second bias voltages respectively. The preamplifier further includes at least one switched capacitor adapted to be selectively and alternatively connected in response to a clock signal: between the at least one input and the at least one output of the operational amplifier; and between the first and second feed nodes. The microphone preamplifier circuit further includes an anti-aliasing filter having: (i) at least one output terminal connected to the at least one input DC decoupling capacitor and (ii) at least one input terminal adapted to be connected to the at least one output node of the microphone circuit.

Description

TECHNICAL FIELD[0001]The present disclosure relates to a microphone preamplifier circuit.BACKGROUND ART[0002]One of the main aspects to take into account in the development of an electronic device, especially mobile devices, is the area occupation. In the field of mobile devices, such as mobile phones, the reduction of the area occupation on the Printed Circuit Board (PCB) is a key point in order to create phones with much more functionalities without altering their dimensions. The focus, during the years, has been to integrate inside a chip, where possible, all those passive components such as resistors, capacitors and inductors which represent the main limit for the area reduction. Inside old generation phones, such passive components were SMD (Surface Mount Devices) mounted directly on the main board. Later on, thanks to improvement in the technology, these devices were placed inside the chip package, a methodology known as PDI (Passive Device Integration), and in some cases dire...

AI Technical Summary

Benefits of technology

This design enables the integration of decoupling capacitors with reduced capacitance values, reducing PCB area occupation and power consumption, while maintaining effective high-pass filtering and audio signal integrity, allowing for more compact and efficient mobile device designs.

Problems solved by technology

However, when it comes to the microphone preamplifying path the implementation of this approach has not been possible due to the huge capacitance value of the decoupling capacitors needed between the microphone and the preamplifier.

In both cases, decoupling capacitors CDEC of more than 100 nF are needed and such large capacitance values would be difficult to integrate in a chip.

In fact, with actual technologies on chip integration of a capacitor having such large capacitance value would require an area greater than 20 mm2 and this fact made the integrating approach practically unusable.

Moreover, unfortunately, even with the PDI methodology the decoupling capacitors CDEC can't be realized because of their high capacitance value and the fact that none of their terminals are connected to a fixed potential.

The same above described problem holds for other consumer devices different from mobile phones, such as portable MP3 players, digital photo cameras, digital audio recorders, video cameras, and in general in devices with audio communication and / or recording and / or processing capabilities.

Moreover, with reference to FIGS. 3 and 4, a further problem of the prior art microphones preamplifiers, especially if they are intended to be embedded in mobile devices, is their power consumption.

However such documents neither refer to microphone systems nor address the above disclosed problem concerning the decoupling capacitor.

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