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Method for connecting diamond thick film with hard base firmly

A diamond thick film and matrix technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., to achieve the effect of firm connection, low heating and cooling rates, and elimination of internal stress

Inactive Publication Date: 2008-02-13
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved in the present invention is to overcome the deficiencies of the background technology, optimize the process and process conditions of the connection between the diamond thick film and the hard alloy or steel substrate, and achieve the purpose of simple process, suitable for practical use, and firm welding

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Pre-processing process:

[0015] a. The thick diamond film is placed in a mixed solution of sulfuric acid: nitric acid=3:1 and boiled for 20 minutes to remove impurities such as graphite on the surface of the diamond film, and rinse the boiled diamond film with clear water.

[0016] b. Treat the connected surface of cemented carbide or steel with a grinding wheel or grinder or sandpaper to remove the oxide film on the surface.

[0017] c. Prepare a 72Ag-28Cu alloy with a suitable size according to the actual needs, and the general thickness is 0.2-0.3mm. A mesh-shaped Ti foil having substantially the same size as that of the Ag-Cu alloy is prepared, and its thickness is generally 20 to 40 μm.

[0018] d. Use acetone or carbon tetrachloride to degrease the diamond thick film, solder, and the surface of the substrate to be connected.

[0019] Loading process:

[0020] Stack the samples of cemented carbide or steel, Ag-Cu alloy, reticular Ti foil, and diamond thick film...

Embodiment 2

[0026] Using mesh 72Ag-28Cu alloy and TiH 2 The specific method of using powder as an additive is as follows: make a 72Ag-28Cu alloy sheet with a thickness of 0.3mm into a mesh shape, the hole diameter is about 0.5mm, and the hole-to-hole interval is 0.5-0.6mm; use ethanol and TiH 2 The powders are mixed together to form a paste and filled into the holes of the Ag-Cu alloy sheet, and placed between the diamond film and the object to be connected. Other technological process is identical with embodiment 1. Ti H 2 The particle size of the powder is finer than 50 μm, and this embodiment uses 30 μm TiH 2 pink.

[0027] Ag-Cu alloy is liquid at high temperature, TiH 2 It is reduced to Ti, a part of Ti forms Ag-Cu-Ti alloy with liquid Ag-Cu alloy and spreads to the welding surface, Ti diffuses to the surface of diamond thick film and forms TiC and Ag-Cu-Ti alloy on the surface of diamond thick film. Metallurgical bonding firmly connects the diamond thick film with the substrate...

Embodiment 3

[0030] Both the 72Ag-28Cu alloy and the Ti foil in Example 1 are made into sheet mesh, and the effect of Example 1 can also be achieved.

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Abstract

A technology for firmly joining thick film of diamond with hard substrate includes such steps as pretreating, sequentially stacking the subsrate, Ag.Cu alloy sheet, Ti foil or TiH2 (or Ti) powder, and thick film of diamond and table in vacuum furnace, vacuumizing, heating to 870 degc, holding the temp for 40-60 min, cooling to 500 deg.C at 8-12 deg.C / min and natural cooling.

Description

technical field [0001] The invention belongs to the welding field of superhard materials, in particular to a method for connecting a diamond film and a substrate. Background technique [0002] Due to its own characteristics, diamond is not compatible with other materials, and it is difficult to firmly connect with other materials. CVD diamond film is a new material, which is a flake material composed entirely of diamond synthesized by chemical vapor deposition method with hydrocarbon gas as raw material. It does not contain other impurities and has the same excellent properties as natural diamond. The use of diamond thick film to make various processing tools has broad application prospects. But because the diamond film has the same properties as natural diamond, it is difficult to form a strong connection with other materials. In order to achieve the purpose of forming a firm connection between diamond and other objects, the following problems must be solved: 1. A carboni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P5/00B23K1/00
Inventor 吕宪义金曾孙吴汉华姜志刚顾长志邹广田
Owner JILIN UNIV