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Preparation method of composite cladding material and equipment

A composite coating and composite plating technology, applied in coatings, electrolytic coatings, cells, etc., can solve the problems of uneven distribution, low percentage of non-metallic particles, low yield, etc., to increase uniformity and improve cladding strength. , the effect of improving the yield

Active Publication Date: 2008-05-28
SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the existing manufacturing methods of composite coating materials have a low percentage of non-metallic particles in the composite coating, uneven distribution, and low yield, which is especially prominent for composite plating of rack-plated large flat materials.

Method used

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  • Preparation method of composite cladding material and equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Cut the plated workpiece 5 of the base pure copper plate into a size of 500*700mm, and perform electrodeposition according to the following steps:

[0019] The following ingredients are configured into composite plating solution 2:

[0020] NiSO 4 ·6H 2 O 250g / L

[0021] NiCl 2 ·6H 2 O 45g / L

[0022] h 3 BO 3 30g / L

[0023] Sodium Gluconate 100g / L

[0024] Surfactant-JFC 2ml / L

[0025] Al 2 o 3 Powder (particle size≤5μm) 80g / L

[0026] ① Soak the pure copper plate in 5% sulfuric acid solution and activate it at room temperature for 1 min;

[0027] ②Clean, then install the hanger and put it into the electrolytic cell 1;

[0028] ③ Turn on the rotating device 10 to rotate the rotating anode 4, turn on the air agitator 9, and pass the pump

[0029] 6 The plating solution can be circulated, and the experiment can be carried out in the electrolytic tank. The parameters of the electroplating process are as follows:

[0030] pH 4.5

[003...

Embodiment 2

[0038] Cut the plated workpiece 5 of the base pure copper plate into a size of 500*700mm, and perform electrodeposition according to the following steps

[0039] The following ingredients are configured into composite plating solution 2:

[0040] NiSO 4 ·6H 2 O 250g / L

[0041] NiCl 2 ·6H 2 O 45g / L

[0042] h 3 BO 3 30g / L

[0043] Sodium Gluconate 100g / L

[0044] TiO 2 Powder (particle size≤5μm) 80g / L

[0045] Surfactant-JFC 2ml / L

[0046] ① Soak the pure copper plate in 5% sulfuric acid solution and activate it at room temperature for 1 min;

[0047] ②Clean, then install the hanger and put it into the electrolytic cell 1;

[0048] ③ Turn on the rotating device 10 to rotate the rotating anode 4, turn on the air agitator 9, and pass the pump 6

[0049] The plating solution can be circulated and experimented in the electrolytic tank. The electroplating process parameters are as follows:

[0050] pH 4.5

[0051] Temperature (°C) 50°C

[0052] ...

Embodiment 3

[0058] Cut the plated workpiece 5 of the base pure copper plate into a size of 500*700mm, and perform electrodeposition according to the following steps:

[0059] The following ingredients are configured into composite plating solution 2:

[0060] NiSO 4 ·6H 2 O 250g / L

[0061] NiCl 2 ·6H 2 O 45g / L

[0062] h 3 BO 3 30g / L

[0063] Sodium Gluconate 100g / L

[0064] SiC powder (particle size≤5mm) 80g / L

[0065] Surfactant-JFC 2ml / L

[0066] ① Soak the pure copper plate in 5% sulfuric acid solution and activate it at room temperature for 1 min;

[0067] ②Clean, then install the hanger and put it into the electrolytic cell 1;

[0068] ③ Turn on the rotating device 10 to rotate the rotating anode 4, turn on the air agitator 9, and pass the pump 6

[0069] The plating solution can be circulated and experimented in the electrolytic tank. The electroplating process parameters are as follows:

[0070] pH 4.5

[0071]Temperature (°C) 50°C

[0072] Curr...

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Abstract

A process for preparing the composite plated layer on substrate includes putting substrate in the electrolyte of electrolyzer, and electroplating while making anode to rotate and stirring the electrolyte by air stirrer. Its apparatus is composed of electrolyzer, anode, rotating triangular anode, pump, air stirrer and filter for removing big particles.

Description

technical field [0001] The invention relates to a preparation method for manufacturing metal composite coating material by electrodeposition method and the equipment used therein. Background technique [0002] Most of the existing manufacturing methods of composite coating materials are that the percentage content of non-metallic particles in the composite coating is low, the distribution is uneven, and the yield is low, especially for the composite coating of rack-plated large flat materials. Contents of the invention [0003] The present invention is achieved through the following technical scheme: a preparation method of a composite coating material, the base material is placed in a composite plating tank equipped with an electrolyte, and the temperature is 50-70°C, the current density is 1-20A / dm 2 Electroplating is carried out under the following conditions, the anode rotates at a speed of 18-25r / min, the best rotation speed of the anode is 20r / min, and the air stir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/04C25D3/12C25D15/00C25D21/10
Inventor 祝天舒余若苇潘昂李从武
Owner SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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