Method for preparing highly heat-conductive carbon/ceramic composite material
A ceramic composite material and high thermal conductivity technology, applied in the field of preparation of high thermal conductivity carbon/ceramic composite materials, can solve the problems of limited space for improving thermal conductivity of carbon/ceramic composite materials, poor structural uniformity, high porosity, etc. The preparation process cycle is short, the cost is low, and the thermal conductivity is good.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0010] First, the natural flake graphite, mesophase pitch, and Si and Ti powders are put into a mixer in a ratio of 57:27:4:12 (wt%) for thorough mixing. Among them, the particle size of natural flake graphite is 350 μm, and the carbon content is 98%; the softening point of mesophase pitch is 280°C, the residual carbon rate is 89.7wt%, and the particle size is 105 μm; the particle size of Si powder and Ti powder are 30 μm and 45 μm, respectively, and the purity is average 99.3%. Then the uniformly mixed raw materials were put into a ball mill, and distilled water and polyvinyl alcohol were introduced into the ball mill for 1.5 hours at the same time, and then vacuum-dried to remove the solvent. Finally, put it into a graphite mold, heat up to 2800°C at a rate of 450°C / h, and pressurize to 30MPa at the highest temperature. After natural cooling, the basic physical properties of the final material are shown in Table 1.
Embodiment 2
[0012] First, the natural flake graphite, mesophase pitch, and Si and Ti powders are put into a mixer in a ratio of 56:28:4:12 (wt%) for thorough mixing. Among them, the particle size of natural flake graphite is 201 μm, and the carbon content is 97.3%; the softening point of mesophase pitch is 266°C, the residual carbon rate is 85.7wt%, and the particle size is 105 μm; the particle size of Si powder and Ti powder are 35 μm and 45 μm respectively, and the purity is average. 99.3%. Then put the homogeneously mixed raw materials into a ball mill, introduce distilled water and polyvinyl alcohol into the ball mill for 3 hours at the same time, and then carry out vacuum drying to remove the solvent. Finally, put it into a graphite mold, heat up to 2800°C at a rate of 400°C / h, and pressurize to 30MPa at the highest temperature. After natural cooling, the basic physical properties of the final material are shown in Table 1.
Embodiment 3
[0014] Firstly, the natural flake graphite, mesophase pitch and Si and Ti powders are placed in a mixer in a ratio of 52:28:5:15 (wt%) for thorough mixing. Among them, the particle size of natural flake graphite is 146 μm, and the carbon content is 97.3%; the softening point of mesophase pitch is 280°C, the residual carbon rate is 89wt%, and the particle size is 105 μm; the particle size of Si powder and Ti powder are 25 μm and 45 μm, respectively, and the purity is 99.3%. Then put the homogeneously mixed raw materials into a ball mill, and introduce distilled water and polyvinyl alcohol into the ball mill for 2.5 hours at the same time, and then carry out vacuum drying to remove the solvent. Finally, put it into a graphite mold, heat up to 2800°C at a rate of 500°C / h, and pressurize to 20MPa at the highest temperature. After natural cooling, the basic physical properties of the final material are shown in Table 1.
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
softening point | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com