Superfine grinding wheel for hard and crisp crystal substrate

Abstract

The invention relates to a rigid crystal substrate ultra-fine grinding wheel. Wherein, it is formed by match ring, substrate ring, and grinding layer; the abrading layer of wheel is formed by abrasive, adhesive, stuff and air hole; the stuff is formed by pH adjuster, oxidant and furnish agent; the substrate ring is mounted on the match ring, via six uniform-distributed hexagonal bolts to be fixed, while they are made from aluminum alloy; the abrading layer is compressed or adhered on the substrate ring; the grinding wheel has high efficiency; the surface of product has low roughness; the inventive crystal substrate has no concave, no crack, etc. And the invention has low cost.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing of hard and brittle crystal substrates, and relates to an ultra-precision grinding wheel for hard and brittle crystal substrates. Background technique [0002] With the rapid development of microelectronics and optoelectronics technology, the processing requirements for hard and brittle crystal substrates such as single crystal silicon, gallium arsenide, and sapphire are becoming more and more stringent. On the one hand, the processed substrates are required to have extremely high geometric precision such as parallelism and flatness; Micro-scratches, micro-defects, micro-cracks, dislocations and other defects and damage. [0003] At present, the processing technology of crystal substrate mainly includes lapping, grinding, chemical etching and chemical mechanical polishing (CMP). Generally, the surface roughness of the crystal substrate is relatively high (Ra0.1-0.2 μm) after g...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to utilize existing fine-grained diamond grinding wheel to grind hard and brittle crystal substrate surface / subsurface damage and defect, and the problem such as high cost, thereby provides a kind of for hard and brittle crystal substrate grinding damage layer is small , low-cost grinding wheel, so that the hard and brittle crystal substrate has no scratches, pits, and micro-cracks, reducing the fragmentation of the grinding surface of the substrate and improving the quality

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