The invention discloses an aqueous dissociating
abrasive cutting fluid used for making a solar
silicon wafer and its preparation method; the
cutting fluid comprises an acrylic thickener,
triethanolamine, a defoaming agent,
triethanolamine oleate
soap and deionized water; on the one hand the
triethanolamine oleate
soap can improve crumpling resistance and lubricating property of the
cutting fluid, and on the other hand, the
triethanolamine oleate soap is anticorrosive, and can prolong the
shelf life of the
cutting fluid and enhance the
cutting fluid stability. At the same time, the
cutting fluid contains a large amount of the deionized water, and the water is large in
specific heat capacity, so that the cutting fluid has good cooling property, and the water solution is easy to wash. In addition, the large amount of deionized water in the components can greatly reduce the cutting fluid production cost and reduce environmental
pollution, the
cut wafer is easy to clean, dirty
wafer is less, and the rate of finished
silicon wafer is high. Finally, the aqueous dissociating
abrasive cutting fluid has the advantages of simple preparation, easy operation, low production cost,
high rate of finished
cut silicon wafer, easy subsequent cleaning, no
pollution to the equipment and the like.