Cutting fluid for cutting of scroll saw

Abstract

The invention discloses a cutting fluid for cutting of a scroll saw. The cutting fluid disclosed by the invention has the advantages of low cost and favorable dispersibility, suspension property, lubricity, cooling property and favorable stability, and thereby the cutting yield is improved. In addition, the cutting fluid disclosed by the invention is environment-friendly and is convenient to recover.

Description

technical field [0001] The invention relates to a cutting fluid, in particular to a cutting fluid for wire saw cutting. Background technique [0002] With the rapid development of the electronics industry, wafers are more and more widely used in integrated circuits, solar cells, LED lighting and other industries, and wire saw cutting of wafers has also received more and more attention. The cutting materials are mainly silicon, germanium, gallium arsenide, sapphire (aluminum oxide) and other hard materials. [0003] The earliest use in the field of wafer processing is the outer circle cutting technology. This cutting method achieves the purpose of cutting by grinding the material to be cut by the diamond sheet grinding wheel clamped on the high-speed rotating spindle. With the development of material preparation technology and the increase of cutting diameter, the rigidity of the outer circular blade is poor, and the problem that the swing amount of the blade is difficult t...

AI Technical Summary

Problems solved by technology

Its disadvantages are: large damage on the surface of the wafer; wide knife edge, large material loss; low productivity; therefore, the internal circle cutting is far from meeting the current production needs in terms of output and capacity, especially the rapid development of large-scale integrated circuits and solar cells. , the demand for wafers increased sharply, and people began to consider adopting more efficient cutting equipment, and the wire saw came into being

[0005] The existing cutting fluids at home and abroad all have the weakness of poor redispersibility. After a long time of storage, silicon carbide will deposit and agglomerate. If you stir again, the silicon carbide cannot be dispersed in the cutting fluid again.

high cost

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