Aqueous dissociating abrasive cutting fluid used for making solar silicon wafer and its preparation method

Abstract

The invention discloses an aqueous dissociating abrasive cutting fluid used for making a solar silicon wafer and its preparation method; the cutting fluid comprises an acrylic thickener, triethanolamine, a defoaming agent, triethanolamine oleate soap and deionized water; on the one hand the triethanolamine oleate soap can improve crumpling resistance and lubricating property of the cutting fluid, and on the other hand, the triethanolamine oleate soap is anticorrosive, and can prolong the shelf life of the cutting fluid and enhance the cutting fluid stability. At the same time, the cutting fluid contains a large amount of the deionized water, and the water is large in specific heat capacity, so that the cutting fluid has good cooling property, and the water solution is easy to wash. In addition, the large amount of deionized water in the components can greatly reduce the cutting fluid production cost and reduce environmental pollution, the cut wafer is easy to clean, dirty wafer is less, and the rate of finished silicon wafer is high. Finally, the aqueous dissociating abrasive cutting fluid has the advantages of simple preparation, easy operation, low production cost, high rate of finished cut silicon wafer, easy subsequent cleaning, no pollution to the equipment and the like.

Description

technical field

[0001] The invention belongs to the technical field of silicon wafer cutting and relates to a cutting fluid, in particular to a water-based free abrasive cutting fluid used in the manufacture of solar silicon wafers and a preparation method thereof. Background technique

[0002] With the increasingly serious problems of global energy shortage and environmental pollution, solar photovoltaic power generation has become an emerging industry that is widely concerned and focused on development because of its clean, safe, convenient, and high-efficiency characteristics. In the photovoltaic solar wafer cutting process, silicon wafer cutting fluid is an auxiliary consumable product that must be used in the silicon wafer cutting process, and its consumption is also expanding with the growth of the photovoltaic solar energy industry and China's silicon wafer processing industry. The cutting fluid is responsible for cooling, suspending, dispersing, lubricating and other...

Examples

preparation example Construction

[0022] The present invention is used for the preparation method of the water-based free abrasive cutting liquid that solar silicon chip is made, comprises the following steps:

[0023] 1) Dissolve 0.5-1.2 parts of ACULYN22 / 23, XC-190, Aculyn33 or T-901 in 98-99 parts of deionized water, and stir until it is fully dispersed in deionized water to obtain a mixed solution;

[0024] 2) Adjust the pH value of the mixed solution to 7.0 with triethanolamine;

[0025] 3) Add 0.10-0.20 parts of silicone defoamer SRECN, silicone defoamer SE-47, silicone oil or cutting fluid foam control agent DF-965 and 0.15-0.25 parts of Triethanolamine oleic acid soap, then stirred until the solute is completely dissolved to obtain a water-based free abrasive cutting fluid for solar silicon wafer manufacturing.

Embodiment 1

[0028] Take 0.5 part of T-901 produced by Shanghai Lingling Chemical Industry, dissolve it in 99 parts of deionized water, and stir it with JJ-1 precision booster electric mixer for 30 minutes to fully disperse the T-901 emulsion in the water. The pH was adjusted to 7.0 using triethanolamine as a neutralizing agent. Then add 0.15 parts of silicone defoamer SRECN and 0.2 parts of triethanolamine oleic acid soap to the system, and continue stirring with JJ-1 precision booster electric stirrer until completely dissolved. A water-based free abrasive cutting fluid for solar wafer fabrication was prepared.

Embodiment 2

[0030] Take 0.6 parts of T-901, dissolve in 98.8 parts of deionized water, and stir with JJ-1 precision booster electric mixer for 30 minutes to fully disperse T-901 emulsion in water. The pH was adjusted to 7.0 using triethanolamine as a neutralizing agent. Then add 0.15 parts of silicone defoamer SRECN and 0.2 parts of triethanolamine oleic acid soap to the system, and continue stirring with JJ-1 precision booster electric stirrer until completely dissolved. A water-based free abrasive cutting fluid for solar wafer fabrication was prepared.

technical field

[0001] The invention belongs to the technical field of silicon wafer cutting and relates to a cutting fluid, in particular to a water-based free abrasive cutting fluid used in the manufacture of solar silicon wafers and a preparation method thereof. Background technique

[0002] With the increasingly serious problems of global energy shortage and environmental pollution, solar photovoltaic power generation has become an emerging industry that is widely concerned and focused on development because of its clean, safe, convenient, and high-efficiency characteristics. In the photovoltaic solar wafer cutting process, silicon wafer cutting fluid is an auxiliary consumable product that must be used in the silicon wafer cutting process, and its consumption is also expanding with the growth of the photovoltaic solar energy industry and China's silicon wafer processing industry. The cutting fluid is responsible for cooling, suspending, dispersing, lubricating and other...

Examples

preparation example Construction

[0022] The present invention is used for the preparation method of the water-based free abrasive cutting liquid that solar silicon chip is made, comprises the following steps:

[0023] 1) Dissolve 0.5-1.2 parts of ACULYN22 / 23, XC-190, Aculyn33 or T-901 in 98-99 parts of deionized water, and stir until it is fully dispersed in deionized water to obtain a mixed solution;

[0024] 2) Adjust the pH value of the mixed solution to 7.0 with triethanolamine;

[0025] 3) Add 0.10-0.20 parts of silicone defoamer SRECN, silicone defoamer SE-47, silicone oil or cutting fluid foam control agent DF-965 and 0.15-0.25 parts of Triethanolamine oleic acid soap, then stirred until the solute is completely dissolved to obtain a water-based free abrasive cutting fluid for solar silicon wafer manufacturing.

Embodiment 1

[0028] Take 0.5 part of T-901 produced by Shanghai Lingling Chemical Industry, dissolve it in 99 parts of deionized water, and stir it with JJ-1 precision booster electric mixer for 30 minutes to fully disperse the T-901 emulsion in the water. The pH was adjusted to 7.0 using triethanolamine as a neutralizing agent. Then add 0.15 parts of silicone defoamer SRECN and 0.2 parts of triethanolamine oleic acid soap to the system, and continue stirring with JJ-1 precision booster electric stirrer until completely dissolved. A water-based free abrasive cutting fluid for solar wafer fabrication was prepared.

Embodiment 2

[0030] Take 0.6 parts of T-901, dissolve in 98.8 parts of deionized water, and stir with JJ-1 precision booster electric mixer for 30 minutes to fully disperse T-901 emulsion in water. The pH was adjusted to 7.0 using triethanolamine as a neutralizing agent. Then add 0.15 parts of silicone defoamer SRECN and 0.2 parts of triethanolamine oleic acid soap to the system, and continue stirring with JJ-1 precision booster electric stirrer until completely dissolved. A water-based free abrasive cutting fluid for solar wafer fabrication was prepared.

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