High temperature resisting dipping glue and application thereof

A technology of impregnating glue and high temperature resistance, used in adhesives, surface etching compositions, chemical instruments and methods, etc., can solve the problems of high price of fluorine-containing monomers, limited application scope, etc., and achieve excellent low moisture absorption performance and low curing. Effect of temperature, good thermal oxidation stability

Inactive Publication Date: 2009-02-18
INST OF CHEM CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high price of fluorine-containing monomers, the scope of application is limited

Method used

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  • High temperature resisting dipping glue and application thereof
  • High temperature resisting dipping glue and application thereof
  • High temperature resisting dipping glue and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Preparation of the first polyimide polymer: 45 parts of 1,4'-bis(4-amino-2-trifluoromethylphenol) benzene was added to 850 parts of N-methylpyrrolidone under inert gas protection and stirring . After the dissolution is complete, add 50 parts of pyromellitic dianhydride in batches at 0-25°C and react for 1-24 hours. A homogeneous viscous liquid was obtained. Add 50 parts of a mixture of acetic anhydride and triethylamine (1:1) into the above liquid under continuous stirring, and react at 0-25°C for 1-24 hours to obtain a transparent solution. Measured at 1720cm by infrared absorption spectrum -1 and 1780cm -1 The characteristic absorption peaks of imine group and carbonyl group appeared, which proved that the corresponding polyimide target product was obtained through the synthesis reaction.

[0049]Preparation of the second polyimide polymer: 50 parts of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride and 3,3',4,4'-benzophenone tetracarboxylic dianhydride The ...

Embodiment 2

[0053] Preparation of the first polyimide polymer: 50 parts of 4,4'-bis(4-amino-2-trifluoromethylphenol) biphenyl was added with 850 parts of N-methylpyrrolidone under inert gas protection stirring middle. After the dissolution is complete, add 48 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride in batches at 0-25°C and react for 1-24 hours to obtain a homogeneous viscous liquid. Add 50 parts of a mixture of acetic anhydride and triethylamine (1:1) into the above liquid under continuous stirring, and react at 0-25°C for 1-24 hours to obtain a transparent solution. The characteristic absorption peaks of imine group and carbonyl group appeared in the infrared absorption spectrum measurement, which proved that the corresponding polyimide target product was obtained through the synthesis reaction.

[0054] Preparation of the second polyimide polymer: add 50 parts of pyromellitic dianhydride to 850 parts of N-methylpyrrolidone under inert gas protection and stirring, af...

Embodiment 3

[0058] Preparation of the first polyimide polymer: 56 parts of 4,4'-bis(3-amino-5-trifluoromethylphenol) biphenyl was added with 850 parts of N-methylpyrrolidone under inert gas protection stirring middle. After the dissolution is complete, add 46 parts of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride in batches at 0-25°C, and react for 1-24 hours. A homogeneous viscous liquid was obtained. Add 50 parts of a mixture of acetic anhydride and triethylamine (1:1) into the above liquid under continuous stirring, and react at 0-25°C for 1-24 hours to obtain a transparent solution. The characteristic absorption peaks of imine group and carbonyl group appeared in the infrared absorption spectrum measurement, which proved that the corresponding polyimide target product was obtained through the synthesis reaction.

[0059] Preparation of the second polyimide polymer: Add 52 parts of bisphenol A dianhydride to 850 parts of N-methylpyrrolidone under inert gas protection and stirr...

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Abstract

The present invention discloses a kind of heat resistant dipping glue comprising two kinds of blended polyimide polymer. The first polyimide polymer is prepared with aromatic fluoric diamine and aromatic tetracid dihydride and through a two-step condensation reaction in organic solvent and under the action of catalyst. The second polyimide polymer is prepared with aromatic tetracid dihydride and aromatic diisocyanate and through a one-step condensation reaction in organic solvent and under the action of catalyst. These two kinds of polyimide polymer are blended in the weight ratio of 2-10 to 1. The heat resistant dipping glue is used in dipping carbon fiber honeycomb material, glass fiber honeycomb material and paper honeycomb material to obtain reinforced heat resistant sandwiched material.

Description

technical field [0001] The invention provides a preparation method and a dipping method of a dipping glue with high temperature resistance made from a blend of two polyimides. Background technique [0002] There are many domestic patent reports on the synthesis and application of impregnating glue (Chinese patents: 02233769.5, 03151268.2, 03178347.3, 200410028458.4, 200510070308.4), but these patents all use phenolic resins as organic binders. Although they have the advantage of being easy to process, they are obviously There are disadvantages of high temperature resistance, poor thermal stability, and poor dielectric properties, which limit the scope of use. Polyimide is a heat-resistant polymer material with excellent comprehensive properties. Since it was developed and industrialized in the United States in the 1960s, it has been applied in various fields. Due to the characteristics of polyimide itself, it is insoluble in general organic solvents, so it is usually proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C09K13/00C09J179/08C03C25/16C03C27/10
Inventor 王贤明杨凯胡爱军杨士勇范琳余刚轩立新卢伟
Owner INST OF CHEM CHINESE ACAD OF SCI
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