Apparatus for rotating point cutting large size silicon-carbide crystal

A large-size, silicon carbide technology, which is applied in the field of rotating point cutting large-size silicon carbide crystal devices, can solve the problems of limited cutting space, easy deformation of the infrastructure, and many times of reciprocation, so as to solve the problem of accuracy, improve the quality of surface shape, The effect of high cutting precision

A large-size, silicon carbide technology, which is applied in the field of rotating point cutting large-size silicon carbide crystal devices, can solve the problems of limited cutting space, easy deformation of the infrastructure, and many times of reciprocation, so as to solve the problem of accuracy, improve the quality of surface shape, The effect of high cutting precision

CN100480015CInactive Publication Date: 2009-04-22张革 +1
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  • Apparatus for rotating point cutting large size silicon-carbide crystal
  • Apparatus for rotating point cutting large size silicon-carbide crystal
  • Apparatus for rotating point cutting large size silicon-carbide crystal

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Effect test

Embodiment Construction

[0026] The rotating point cutting device for large-size silicon carbide crystals consists of a base 5, a sensor 10, a diamond saw wire 6, a pneumatic tension wheel 2, a working roller 3, a DC servo motor 13, and a two-dimensional fixture mechanism 9. The two-dimensional fixture mechanism 9 is composed of a rotating manipulator 11 and a stepping motor 12. A horizontal angle adjustment turntable 20 is connected to the Y-axis moving platform 21. A vertical angle adjustment turntable 22 is connected to the horizontal angle adjustment turntable 20. The stepping motor 12 is connected to the The adjustable support plate 19 is connected with the material fixture 16 through the rotating shaft 18 . A clamp cover 8 is arranged on the clamp 16, and a top wire 15 is housed on the clamp cover 8 to adjust the center position of the material. The rear part of the clamp is equipped with a rolling bearing 17.

[0027] As shown in the figure: the design concept of the present invention, based on...

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Abstract

An apparatus for cutting large-size SiC crystal by the moving dots is composed of base, sensor, sawing diamond string, pneumatic tension roller, working rollers, DC servo motor and 2D fixture mechanism consisting of rotary manipulator and step motor. A horizontal angle regulating turn-table is linked on a Y-axis moving platform. A vertical angle regulating turn-table is linked on said horizontal angle regulating one. Said step motor is fixed to an adjustable supporting plate.

Description

technical field [0001] The invention relates to a material processing equipment, in particular to a rotating point cutting large-size silicon carbide crystal device. Background technique [0002] SiC (silicon carbide crystal) is a superhard material with a Mohs hardness of 9.4, and only diamond materials with a Mohs hardness of 10 can be used to cut SiC. The existing traditional diamond saw blade can cut SiC due to the limitation of the diameter of the saw blade, and can only cut the bar with a diameter of less than 25mm, and the cutting kerf is wide due to the thickness of the saw blade, wasting expensive SiC materials. In the past five years, the diamond saw wire cutting equipment has been developed, and the cutting of SiC has been realized. For this reason, I have filed a number of patent applications, such as "desktop large-size precision diamond wire cutting machine (patent application number: 200410050285.6)", "gravity type Outer circle diamond outer circle cutting ma...

Claims

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Application Information

Patent Timeline
22 Apr 2009
Publication
CN100480015C
IPC
B28D1/22; B28D5/00; B28D1/12; B26D1/547
Inventors
张革; 李景春