Polyimide semi-interpenetrating network resin and its prepn. method
A technology of semi-interpenetrating network and polyimide, which is applied in the field of engineering plastics, polyimide semi-interpenetrating network resin and its preparation, can solve the problem of high service temperature, achieve wide application fields, high mechanical properties, high The effect of heat resistance
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Embodiment 1
[0020] Mix 70g of thermoplastic polyimide powder, 30g of bismaleimide powder and 10g of graphite in a high-speed mixer for 2 minutes, and put the resulting mixture that can form a semi-interpenetrating network (hereinafter referred to as the mixture) into the mold. Molding at 380°C and 20Mpa to obtain a plate with a thickness of 5mm.
Embodiment 2
[0022] A solution of 70g of thermoplastic polyimide in 600ml of cresol was mixed with 30g of bismaleimide powder and 10g of carbon fiber at 120°C for 30min, poured into 2000ml of ethanol, and the resulting precipitate was washed 3 times with cold ethanol, 70 ℃ vacuum drying to obtain the mixture.
Embodiment 3
[0024] 30 g of bismaleimide is melted in a constant temperature bath of 150° C., 30 g of thermoplastic polyimide and 5 g of polytetrafluoroethylene powder are added under stirring, and then stirred for 2 minutes, cooled and pulverized to obtain a mixture.
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