Manufacturing method of tin ball for packaging semiconductor chip/paste
A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of lower yield rate, great influence on quality yield rate, and great influence on upper board soldering precision. , to achieve the effect of simplifying the manufacturing process and improving product quality
Active Publication Date: 2009-07-01
上海锡喜材料科技有限公司
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Problems solved by technology
[0003] The known method of manufacturing solder balls for packaging is to make a small core wire with a small diameter after cutting the metal wire, and then go through a solder ball forming process to make the required solder balls. However, the solder balls The manufacturing process capability of forming has a great influence on the quality and yield rate. In terms of the commonly used solder ball manufacturing method for packaging, in the solder ball forming manufacturing process, the wire passes through a wind tunnel airflow forming device and then passes through a circular mold. In order to make the required spherical shape, but the solder balls formed by this wind tunnel airflow molding manufacturing process will have burrs or abnormal balls according to the direction of airflow rotation after blowing out, which is not only for the subsequent implementation of the upper board The precision of soldering has a great influence, which also leads to a decrease in the overall yield rate and a relative increase in manufacturing costs.
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[0033] see figure 1 As shown, the present invention is used for the manufacture method of the tin ball of encapsulating semiconductor chip / patch, first metal wire 1 is cut into the section material of required finished product size in cutting machine 2, then the section material is given Carry out the cleaning treatment of residues or dust attached to the surface 3, after the cleaning treatment, the section material is dried in the dryer 4, and then the glycerin (glycerol) that will be mixed with the material is adjusted according to the temperature of the molten state of the material. ) after heating at 183°C or below 400°C (depending on the temperature of the molten state of the material), mix glycerin with the material to make the material in a molten state, and then go through free-falling solder ball molding treatment method 5 to produce Solder balls of the required size (within the tolerance range), and then clean the surface of the formed solder balls 6, add anti-oxidat...
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Abstract
This invention discloses a making method of packaging semiconductor chip or paster for tin ball, which has the following steps: cutting the metal wire into needed sectional wire, then clearing the wire, wherein the clearing processing has the following steps: heating glycerol up the 183DEG. or under 400DEG., then mixing the material an glycerol up, melting, using falling free method to obtain the needed tin spherical, then clearing the tin spherical, adding anti-oxidant to exclude static process, then finishing selection and checking to make out the packaging tin ball with optimum quality.
Description
technical field [0001] The invention relates to a method for manufacturing solder balls used for packaging semiconductor chips / patches. Background technique [0002] At present, the packaging methods of semiconductor post-manufacturing procedures have gradually adopted more advanced packaging methods such as BGA (Ball Grid Array Components) and CSP (Communication Scanner Processor Communication Scanner Processor), and the solder pins are replaced by solder balls. It can directly solder the upper plate to reduce the overall package size, so the precision of the upper plate soldering is affected by the quality of the solder balls, so the quality of the solder balls is also an important factor affecting the quality of the package. [0003] The known method of manufacturing solder balls for packaging is to make a small core wire with a small diameter after cutting the metal wire, and then go through a solder ball forming process to make the required solder balls. However, the so...
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IPC IPC(8): H01L21/60H01L21/48H01L21/02
CPCH01L2224/16H01L2924/0002
Inventor 王旭王国富
Owner 上海锡喜材料科技有限公司