Method for forming finely porous metal thin film through jet ink technique

Abstract

The invention discloses a method for forming a microporous metal film by an inkjet method. After surface treatment is carried out on the surface of a substrate, a catalyst is sprayed in the micropore by means of micro-droplet spraying, and the catalyst is adsorbed and dried there. Micropore inner wall. After the substrate is treated, due to the change of surface properties, the plating solution is easy to enter the micropores, and a metal film is formed on the inner wall of the micropores, which can prevent the air from remaining in the micropores from causing incomplete chemical plating and forming an open circuit. Very good adhesion between metals, which can improve the peeling of plating (metal film). In addition, this spraying method can reduce the use of precious metal salts (catalysts), the production process and the generation of waste photoresist etching liquid. In addition, it does not need expensive equipment and space such as exposure, development, and laser drilling. Reduce the cost of the process and meet the requirements of environmental protection.

Description

technical field [0001] The invention relates to a method for forming a microporous metal film, in particular to a method for forming a microporous metal film by an inkjet method. Background technique [0002] With the rapid and vigorous development of information, communication and general consumer electronics products, the manufacture of printed circuit boards (PCBs) is gradually developing towards multi-layer, multi-functional and integrated directions. This further promotes the design and design of printed circuit boards with a large number of fine holes, narrow pitches, and thin wires, which increases the difficulty of printed circuit board manufacturing technology, especially the multi-layer through holes with an aspect ratio of more than five to one and deeper holes. When blind holes are used, it will make it difficult for the commonly used metal deposition methods to meet the technical requirements of high-quality and high-reliability interconnection holes. [0003] ...

AI Technical Summary

Problems solved by technology

[0020] In view of the above problems, the main purpose of the present invention is to provide a method for forming a microporous metal film by an inkjet method, mainly by changing the surface properties of the substrate to have hydrophilicity, so that the plating solution can easily enter the micropores and carry out the chemical process. plating

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