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New type polyimide resin, and preparation method

The technology of polyimide resin and polyamic acid resin is applied in the field of polyimide resin and its preparation method, and can solve the problem of large dimensional change of laminated board, reduced dimensional stability, and elastic modulus of polyimide resin layer. drop and other problems, to achieve the effect of high dimensional stability, excellent heat resistance, and low water absorption

Active Publication Date: 2009-08-05
CHANG CHUN PLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the application of too many long-chain monomers will cause the elastic modulus of the polyimide resin layer to decrease, and the linear expansion coefficient will increase, resulting in a large change in the size of the prepared laminate and a decrease in dimensional stability.

Method used

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  • New type polyimide resin, and preparation method
  • New type polyimide resin, and preparation method
  • New type polyimide resin, and preparation method

Examples

Experimental program
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preparation example Construction

[0035] The preparation of PBTDA can be obtained by existing methods, for example, Japanese Patent No. 43-5911 uses benzene and toluene as solvents, and is prepared by reacting anhydrous chlorides with glycols; The product is obtained by transesterifying anhydrous acid compound trimellitic anhydride (TMA, Trimelltic Anhydride) with diesters in a solvent-like solvent. The PBTDA preparation method is shown in Reaction Formula 1.

[0036] Reaction 1

[0037]

[0038] In an embodiment of the present invention, the content of the diamine monomer used in the preparation of the polyimide resin is based on the total amount of the dianhydride monomer, and the content of the dianhydride monomer shown in formula (I) is 10 to 20 moles % is preferred; the content of the 3,3', 4,4'-benzophenone tetracarboxylic dianhydride (BTDA) monomer is preferably 40 to 50 mole %; the 3,3', 4, The content of 4'-biphenyltetracarboxylic dianhydride monomer (BPDA) is preferably 30 to 40 mol%.

[0039]...

Embodiment 1

[0063] Put 6.48 grams of PDA (0.06 moles), 8.01 grams of ODA (0.04 moles) and 100 grams of NMP into a four-neck reactor with a stirrer and a nitrogen conduit for dissolution. The nitrogen flow rate is 20cc / min. Stir to dissolve evenly After that, maintain 15°C. The reaction was carried out for 30 minutes, and then 50 grams of toluene was added to the reaction kettle.

[0064] Take three flasks with stirring bars respectively, put 5.77 g of BPDA (0.02 mol) and 20 g of NMP into the first flask, and stir to dissolve them. 2.67 grams of PBTDA (0.005 mol) and 10 grams of NMP were placed in the second flask and stirred to dissolve them. Add the solutions in the first and second flasks into the reaction kettle, continuously introduce nitrogen, and stir for 15 minutes.

[0065] Put 24.17 grams of BTDA (0.075 mole) and 90 grams of NMP into the third flask, stir to dissolve them. Then, every 30 minutes, the solution in the third flask was added to the reaction kettle, and nitrogen ga...

Embodiment 2 to Embodiment 8

[0068] Repeat the steps of Example 1, and the molar amounts of each component are as shown in Table 1.

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Abstract

The present invention provides a kind of polyimide resin, and this resin is by at least comprising the dianhydride monomer shown in formula (I) and diamine monomer to carry out polymerization reaction to form polyamic acid resin, then carries out imidization reaction to form Form; polyimide resin of the present invention is to use specific dianhydride monomer and diamine monomer to react, and biphenyl structure is introduced into the main chain part of polyimide resin, and the water absorption of polyimide resin is improved and coefficient of thermal expansion, making it soluble in organic solvents, while taking into account the heat resistance and dimensional stability of the polyimide resin; therefore, the polyimide resin of the present invention has low water absorption, low coefficient of thermal expansion, high peel strength, High dimensional stability and excellent heat resistance.

Description

technical field [0001] The present invention relates to a polyimide resin and a preparation method thereof, in particular to a polyimide resin formed from dianhydride monomers and diamine monomers and a preparation method thereof. Background technique [0002] In recent years, due to the thinning and miniaturization requirements of electronic and communication equipment, the packaging volume of integrated circuits in the equipment is also developing towards miniaturization and thinning, and the wiring circuit boards used are also becoming more and more miniaturized. Among various wiring circuit boards, flexible printed circuit boards can greatly reduce the volume and weight of electronic components, and are a commonly used wiring circuit board. [0003] Usually the structure of the flexible printed circuit board includes an insulating base material and a metal conductor layer, and the insulating base material and the metal conductor layer are bonded with an adhesive to form ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10
Inventor 黄坤源杜安邦巫胜彦
Owner CHANG CHUN PLASTICS CO LTD