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Method for mfg. micro-display

A technology of micro-display and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, static indicators, electrical components, etc., can solve the problems that the aperture ratio and component performance cannot be further improved, and achieve the improvement of light reflectivity and component performance, and improve Aperture ratio, effect of shrinking etch mask

Active Publication Date: 2009-09-23
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, microdisplays using LCOS as liquid crystal panels cannot further improve the aperture ratio and device performance due to the limitation of the photolithography process. Therefore, how to improve the aperture ratio and device performance has become the focus of the development of microdisplays.

Method used

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  • Method for mfg. micro-display
  • Method for mfg. micro-display
  • Method for mfg. micro-display

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Experimental program
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Embodiment Construction

[0040] Figure 1A to Figure 1F It is a schematic cross-sectional flow diagram of a microdisplay manufacturing method according to an embodiment of the present invention.

[0041] First, please refer to Figure 1A , provide a chip 100, the driver circuit has been formed on this chip 100 (please refer to figure 2 ). The wafer 100 is, for example, a silicon wafer. figure 2 The driving circuit shown is, for example, fabricated using a standard complementary metal-oxide-semiconductor (CMOS) process. The driving circuit includes a transistor 200, a capacitor 202, and an interconnection structure 204, and its formation methods and materials are all in the art It is well known by personnel and will not be repeated here. In addition, in the subsequent figures, the illustration in figure 2 Each structure in .

[0042] Then, please refer to Figure 1B , forming a metal reflective layer 102 on the wafer 100 . The metal reflective layer 102 is formed by, for example, chemical vap...

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Abstract

The invention is a micro display manufacturing method, firstly providing a wafer formed with drive circuit; then forming a metal reflecting layer on the wafer; successively forming antireflective layer and patternized photoresist layer on the metal reflecting layer; then using the photoresist layer as etching mask to form a trench pattern in the antireflective layer and metal reflecting layer so as to expose the wafer surface; then removing the photoresist layer; then forming a dielectric layer to cover the antireflective layer and filling the dielectric layer in the trench pattern; removing parts of the dielectric layer and antireflective layer until exposing the surface of the metal reflecting layer.

Description

technical field [0001] The invention relates to a method for manufacturing a microdisplay, in particular to a method for manufacturing a microdisplay that can increase the aperture ratio of the microdisplay. Background technique [0002] In recent years, the LCD pixel structure has gradually been widely used in daily life, such as LCD TVs, LCD screens of laptop computers or desktop computers, and LCD projectors. Among them, the liquid crystal projector is one of the indispensable tools for large-scale display, and the core of the liquid crystal projector lies in its optical engine for projection. (R, G, B) liquid crystal panel (panel). The above-mentioned liquid crystal panel adopts LCOS (liquid crystal on silicon), which is a kind of micro-display, because the size of the pixel structure should be taken into consideration. [0003] LCOS is a liquid crystal panel built on a silicon wafer backpanel. Because this kind of LCOS liquid crystal panel using a silicon wafer as a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00G02F1/133
Inventor 吴沂庭陈世鸿蔡怀萱郑志鸿蔡健华陈炫旭
Owner UNITED MICROELECTRONICS CORP